Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170320 | Feature fill with multi-stage nucleation inhibition | Deqi Wang, Raashina Humayun, Michal Danek | 2019-01-01 |
| 10103058 | Tungsten feature fill | Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang | 2018-10-16 |
| 9997405 | Feature fill with nucleation inhibition | Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang | 2018-06-12 |
| 9978610 | Pulsing RF power in etch process to enhance tungsten gapfill performance | Waikit Fung, Liang Meng | 2018-05-22 |
| 9972504 | Atomic layer etching of tungsten for enhanced tungsten deposition fill | Chiukin Steven Lai, Keren Jacobs Kanarik, Samantha Tan, Teh-Tien Su, Wenbing Yang +2 more | 2018-05-15 |
| 9673146 | Low temperature tungsten film deposition for small critical dimension contacts and interconnects | Feng Chen, Raashina Humayun, Michal Danek | 2017-06-06 |
| 9653353 | Tungsten feature fill | Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang | 2017-05-16 |
| 9589835 | Method for forming tungsten film having low resistivity, low roughness and high reflectivity | Raashina Humayun | 2017-03-07 |
| 9548228 | Void free tungsten fill in different sized features | Raashina Humayun | 2017-01-17 |
| 9240347 | Tungsten feature fill | Esther Jeng, Raashina Humayun, Michal Danek, Juwen Gao, Deqi Wang | 2016-01-19 |
| 9236297 | Low tempature tungsten film deposition for small critical dimension contacts and interconnects | Feng Chen, Raashina Humayun, Michal Danek | 2016-01-12 |
| 9082826 | Methods and apparatuses for void-free tungsten fill in three-dimensional semiconductor features | Joydeep Guha, Raashina Humayun, Hua Xiang | 2015-07-14 |
| 9034768 | Depositing tungsten into high aspect ratio features | Raashina Humayun, Michal Danek, Aaron R. Fellis, Sean Chang | 2015-05-19 |
| 8883637 | Systems and methods for controlling etch selectivity of various materials | Esther Jeng, Raashina Humayun, Michal Danek, Ronald A. Powell | 2014-11-11 |
| 8835317 | Depositing tungsten into high aspect ratio features | Raashina Humayun, Michal Danek, Aaron R. Fellis, Sean Chang | 2014-09-16 |
| 8623733 | Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnects | Feng Chen, Raashina Humayun, Michal Danek | 2014-01-07 |
| 8501620 | Method for depositing tungsten film having low resistivity, low roughness and high reflectivity | Raashina Humayun | 2013-08-06 |
| 8435894 | Depositing tungsten into high aspect ratio features | Raashina Humayun, Michal Danek, Aaron R. Fellis, Sean Chang | 2013-05-07 |
| 8409987 | Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics | Mirko Glass, Raashina Humayun, Michal Danek, Kaihan Ashtiani, Feng Chen +2 more | 2013-04-02 |
| 8153520 | Thinning tungsten layer after through silicon via filling | Raashina Humayun, Michal Danek | 2012-04-10 |
| 8129270 | Method for depositing tungsten film having low resistivity, low roughness and high reflectivity | Raashina Humayun | 2012-03-06 |
| 8124531 | Depositing tungsten into high aspect ratio features | Raashina Humayun, Michal Danek, Aaron R. Fellis, Sean Chang | 2012-02-28 |
| 8058170 | Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics | Mirko Glass, Raashina Humayun, Michael Danek, Kaihan Ashtiani, Feng Chen +2 more | 2011-11-15 |