Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6905959 | Apparatus and method for depositing superior Ta (N) copper thin films for barrier and seed applications in semiconductor processing | Kaihan Ashtiani, Maximilian A. Biberger, Erich R. Klawuhn, Kwok Fai Lai, Karl B. Levy | 2005-06-14 |
| 6541371 | Apparatus and method for depositing superior Ta(N)/copper thin films for barrier and seed applications in semiconductor processing | Kaihan Ashtiani, Maximilian A. Biberger, Erich R. Klawuhn, Kwok Fai Lai, Karl B. Levy | 2003-04-01 |