Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707122 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, Mehul Naik +6 more | 2020-07-07 |
| 10546742 | Method to reduce trap-induced capacitance in interconnect dielectric barrier stack | He Ren, Mehul Naik, Yong Cao, Yana Cheng | 2020-01-28 |
| 10170299 | Method to reduce trap-induced capacitance in interconnect dielectric barrier stack | He Ren, Mehul Naik, Yong Cao, Yana Cheng | 2019-01-01 |
| 10109520 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, Mehul Naik +6 more | 2018-10-23 |
| 10043709 | Methods for thermally forming a selective cobalt layer | Hua Ai, Jiang Lu, Avgerinos V. Gelatos, Paul F. Ma, Sang Ho Yu +2 more | 2018-08-07 |
| 9633861 | Cu/barrier interface enhancement | Mei-Yee Shek, Mihaela Balseanu, Xiaojun Zhang, Xiaolan Ba, Yu Jin +1 more | 2017-04-25 |
| 9580801 | Enhancing electrical property and UV compatibility of ultrathin blok barrier film | Xiaolan Ba, Mei-Yee Shek, Yu Jin, Li-Qun Xia, Deenesh Padhi +1 more | 2017-02-28 |
| 9478460 | Cobalt selectivity improvement in selective cobalt process sequence | Mei-Yee Shek, Li-Qun Xia, Kang Sub Yim, Kelvin Chan | 2016-10-25 |
| 9105695 | Cobalt selectivity improvement in selective cobalt process sequence | Mei-Yee Shek, Li-Qun Xia, Kang Sub Yim, Kelvin Chan | 2015-08-11 |
| 8758638 | Copper oxide removal techniques | Victor Nguyen, Mei-Yee Shek, Mihaela Balseanu, Li-Qun Xia, Derek R. Witty | 2014-06-24 |