| 12217955 |
Method for etching features using a targeted deposition for selective passivation |
Wenchi LIU, Zhongkui Tan, Juan Valdivia, Colin Richard REMENTER, Yoko Yamaguchi +3 more |
2025-02-04 |
| 12165872 |
Methods and systems for advanced ion control for etching processes |
Zhongkui Tan, Qian Fu, Ying Wu, John Drewery |
2024-12-10 |
| 11049726 |
Methods and systems for advanced ion control for etching processes |
Zhongkui Tan, Qian Fu, Ying Wu, John Drewery |
2021-06-29 |
| 10943789 |
Methods and systems for advanced ion control for etching processes |
Zhongkui Tan, Qian Fu, Ying Wu, John Drewery |
2021-03-09 |
| 10658194 |
Silicon-based deposition for semiconductor processing |
Zhongkui Tan, Qian Fu, Hua Xiang, Lin Zhao |
2020-05-19 |
| 10242845 |
Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamber |
Zhongkui Tan, Yiting Zhang, Qian Fu, Ying Wu, Saravanapriyan Sriraman +1 more |
2019-03-26 |
| 10177003 |
Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level |
Zhongkui Tan, Qian Fu, Ying Wu, Hua Xiang |
2019-01-08 |
| 9997366 |
Silicon oxide silicon nitride stack ion-assisted etch |
Zhongkui Tan, Hua Xiang, Wenbing Hu, Qian Fu |
2018-06-12 |
| 9991128 |
Atomic layer etching in continuous plasma |
Zhongkui Tan, Yiting Zhang, Ying Wu, Qian Fu, Yoko Yamaguchi +1 more |
2018-06-05 |
| 9941178 |
Methods for detecting endpoint for through-silicon via reveal applications |
Alan J. Miller, Evelio Sevillano, Jorge Luque, Andrew D. Bailey, III |
2018-04-10 |
| 9859127 |
Line edge roughness improvement with photon-assisted plasma process |
Zhongkui Tan, Qian Fu, Sangjun Park |
2018-01-02 |
| 9852924 |
Line edge roughness improvement with sidewall sputtering |
Zhongkui Tan, Hua Xiang, Yiting Zhang, Qian Fu |
2017-12-26 |
| 9824896 |
Methods and systems for advanced ion control for etching processes |
Zhongkui Tan, Qian Fu, Ying Wu, John Drewery |
2017-11-21 |
| 9767991 |
Methods and systems for independent control of radical density, ion density, and ion energy in pulsed plasma semiconductor device fabrication |
Zhongkui Tan, Qian Fu, Ying Wu |
2017-09-19 |
| 9691625 |
Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level |
Zhongkui Tan, Qian Fu, Ying Wu |
2017-06-27 |
| 9543225 |
Systems and methods for detecting endpoint for through-silicon via reveal applications |
Alan J. Miller, Evelio Sevillano, Jorge Luque, Andrew D. Bailey, III |
2017-01-10 |
| 8871105 |
Method for achieving smooth side walls after Bosch etch process |
Jaroslaw W. Winniczek, Frank Y. Lin, Alan J. Miller, Seongjun Heo, Jin-Hwan Ham +2 more |
2014-10-28 |
| 8691698 |
Controlled gas mixing for smooth sidewall rapid alternating etch process |
William Thie, Camelia Rusu |
2014-04-08 |
| 8609548 |
Method for providing high etch rate |
Camelia Rusu, Jaroslaw W. Winniczek, Frank Y. Lin, Alan J. Miller |
2013-12-17 |
| 8440473 |
Use of spectrum to synchronize RF switching with gas switching during etch |
Camelia Rusu, Brian McMillin, Alexander Paterson |
2013-05-14 |
