Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12217955 | Method for etching features using a targeted deposition for selective passivation | Wenchi LIU, Juan Valdivia, Colin Richard REMENTER, Qing Xu, Yoko Yamaguchi +3 more | 2025-02-04 |
| 12165878 | Semiconductor mask reshaping using a sacrificial layer | Xiaofeng Su, Hua Xiang, Ce Qin | 2024-12-10 |
| 12165872 | Methods and systems for advanced ion control for etching processes | Qian Fu, Ying Wu, Qing Xu, John Drewery | 2024-12-10 |
| 11798785 | Systems for reverse pulsing | Maolin Long, Ying Wu, Qian Fu, Alex Paterson, John Drewery | 2023-10-24 |
| 11742212 | Directional deposition in etch chamber | Lisi Xie, Yoko Yamaguchi, Yasushi Ishikawa, Patrick Ponath, Sung Jin Jung +3 more | 2023-08-29 |
| 11646207 | Silicon oxide silicon nitride stack stair step etch | Ce Qin, Qian Fu, Sam Do Lee | 2023-05-09 |
| 11049726 | Methods and systems for advanced ion control for etching processes | Qian Fu, Ying Wu, Qing Xu, John Drewery | 2021-06-29 |
| 11037784 | Amorphous carbon layer opening process | Ce Qin, Yisha Mao, Yansha Jin, Austin Casey Faucett | 2021-06-15 |
| 10943789 | Methods and systems for advanced ion control for etching processes | Qian Fu, Ying Wu, Qing Xu, John Drewery | 2021-03-09 |
| 10658194 | Silicon-based deposition for semiconductor processing | Qing Xu, Qian Fu, Hua Xiang, Lin Zhao | 2020-05-19 |
| 10354888 | Method and apparatus for anisotropic tungsten etching | Qian Fu, Huai-Yu Hsiao | 2019-07-16 |
| 10242845 | Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamber | Yiting Zhang, Qian Fu, Qing Xu, Ying Wu, Saravanapriyan Sriraman +1 more | 2019-03-26 |
| 10177003 | Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level | Qian Fu, Ying Wu, Qing Xu, Hua Xiang | 2019-01-08 |
| 10020183 | Edge roughness reduction | Yansha Jin, Lin Cui, Qian Fu, Martin Shim | 2018-07-10 |
| 9997366 | Silicon oxide silicon nitride stack ion-assisted etch | Hua Xiang, Wenbing Hu, Qing Xu, Qian Fu | 2018-06-12 |
| 9991128 | Atomic layer etching in continuous plasma | Yiting Zhang, Ying Wu, Qing Xu, Qian Fu, Yoko Yamaguchi +1 more | 2018-06-05 |
| 9859127 | Line edge roughness improvement with photon-assisted plasma process | Qing Xu, Qian Fu, Sangjun Park | 2018-01-02 |
| 9852924 | Line edge roughness improvement with sidewall sputtering | Hua Xiang, Yiting Zhang, Qian Fu, Qing Xu | 2017-12-26 |
| 9824896 | Methods and systems for advanced ion control for etching processes | Qian Fu, Ying Wu, Qing Xu, John Drewery | 2017-11-21 |
| 9767991 | Methods and systems for independent control of radical density, ion density, and ion energy in pulsed plasma semiconductor device fabrication | Qian Fu, Ying Wu, Qing Xu | 2017-09-19 |
| 9761459 | Systems and methods for reverse pulsing | Maolin Long, Ying Wu, Qian Fu, Alex Paterson, John Drewery | 2017-09-12 |
| 9691625 | Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level | Qian Fu, Ying Wu, Qing Xu | 2017-06-27 |
| 9633867 | Method and apparatus for anisotropic tungsten etching | Qian Fu, Huai-Yu Hsiao | 2017-04-25 |
| 9583357 | Systems and methods for reverse pulsing | Maolin Long, Ying Wu, Qian Fu, Alex Paterson, John Drewery | 2017-02-28 |