| 9905402 |
Plasma processing chamber with a grounded electrode assembly |
Anwar Husain |
2018-02-27 |
$105,153,000 |
| 9111968 |
Plasma processing chamber with a grounded electrode assembly |
Anwer Husain |
2015-08-18 |
$12,105,000 |
| 8900400 |
Proximity head having a fluid resistor |
Cheng-Yu Lin, Russell Martin |
2014-12-02 |
$6,421,000 |
| 8757177 |
Multi-stage substrate cleaning method and apparatus |
Katrina Mikhaylichenko, Cheng-Yu Lin, Mark Wilcoxson, Leon Ginzburg, Mark Kawaguchi |
2014-06-24 |
$19,471,000 |
| 8739805 |
Confinement of foam delivered by a proximity head |
Cheng-Yu Lin, Leon Ginzburg, Mark Mandelboym, Gregory A. Tomasch, Anwar Husain |
2014-06-03 |
$19,987,000 |
| 8584613 |
Single substrate processing head for particle removal using low viscosity fluid |
Cheng-Yu Lin, Leon Ginzburg, Mark Mandelboym, Gregory A. Tomasch, Anwar Husain |
2013-11-19 |
$6,432,000 |
| 8557051 |
Method for using generator for foam to clean substrate |
Anwar Husain, Gregory A. Tomasch, Cheng-Yu Lin |
2013-10-15 |
$21,702,000 |
| 8317934 |
Multi-stage substrate cleaning method and apparatus |
Katrina Mikhaylichenko, Cheng-Yu Lin, Mark Wilcoxson, Leon Ginzburg, Mark Kawaguchi |
2012-11-27 |
$4,192,000 |
| 8317966 |
Apparatus for substantially uniform fluid flow rates relative to a proximity head in processing of a wafer surface by a meniscus |
Cheng-Yu Lin, Russell Martin |
2012-11-27 |
$4,192,000 |
| 8313582 |
System, method and apparatus for maintaining separation of liquids in a controlled meniscus |
Robert O'Donnell, Cheng-Yu Lin |
2012-11-20 |
$3,027,000 |
| 8292697 |
Method for manufacturing a hybrid composite wafer carrier for wet clean equipment |
Wing Cheng |
2012-10-23 |
$4,696,000 |
| 8261905 |
Wafer carrier drive apparatus and method for operating the same |
Anwar Husain, George Khait |
2012-09-11 |
$5,557,000 |
| 8246755 |
In situ morphological characterization of foam for a proximity head |
Gregrory A. Tomasch, Leonid Isaakovich Ginzburg, Cheng-Yu Lin |
2012-08-21 |
$18,903,000 |
| 8161984 |
Generator for foam to clean substrate |
Anwar Husain, Gregory A. Tomasch, Cheng-Yu Lin |
2012-04-24 |
$7,669,000 |
| 8146902 |
Hybrid composite wafer carrier for wet clean equipment |
Wing Cheng |
2012-04-03 |
$8,283,000 |
| 8141566 |
System, method and apparatus for maintaining separation of liquids in a controlled meniscus |
Robert O'Donnell, Cheng-Yu Lin |
2012-03-27 |
$8,748,000 |
| 7998304 |
Methods of configuring a proximity head that provides uniform fluid flow relative to a wafer |
Cheng-Yu Lin |
2011-08-16 |
$5,000,000 |
| 7743730 |
Apparatus for an optimized plasma chamber grounded electrode assembly |
Anwar Husain |
2010-06-29 |
$17,114,000 |
| 7699634 |
High power electrical connector for a laminated heater |
Russell Martin, John Rasnick, Christopher Kimball |
2010-04-20 |
$42,192,000 |
| 7572334 |
Apparatus for fabricating large-surface area polycrystalline silicon sheets for solar cell application |
Robert Z. Bachrach, Mark Mandelboym |
2009-08-11 |
$21,048,000 |
| 6908540 |
Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
— |
2005-06-21 |
$30,094,000 |
| 6828241 |
Efficient cleaning by secondary in-situ activation of etch precursor from remote plasma source |
Peter I. Porshnev |
2004-12-07 |
$16,454,000 |
| 6795292 |
Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber |
Dennis S. Grimard, Alex Veytser, Senh Thach, Wing Cheng |
2004-09-21 |
|
| 6736668 |
High temperature electrical connector |
Senh Thach, Wing Cheng, Alvin Lau, Dennis S. Grimard |
2004-05-18 |
|
| 6721162 |
Electrostatic chuck having composite dielectric layer and method of manufacture |
Edwin C. Weldon, Kenneth S. Collins, Arik Donde, Brian Lue, Dan Maydan +8 more |
2004-04-13 |
$29,327,000 |
