Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber

Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber

US Patent 6795292 · Granted Sep 21, 2004

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High temperature electrostatic chuck bonding adhesive2022
High definition heater system having a fluid medium2021
High definition heater and method of operation2020
Method of processing a substrate support assembly2020
Real time monitoring with closed loop chucking force control2019
Pixilated cooling, temperature controlled substrate support assembly2019
High definition heater system having a fluid medium2019
Electrostatic chuck with external flow adjustments for improved temperature dist2018
High definition heater and method of operation2018
Substrate support assembly having a plasma resistant protective layer2018
Plasma processing chamber with a grounded electrode assembly2018
Control systems employing deflection sensors to control clamping forces applied 2018