| 11264261 |
High temperature electrostatic chuck bonding adhesive |
Jennifer Y. Sun, Ren-Guan Duan |
2022-03-01 |
$41,046,000 |
| 10557202 |
Method of processing a substrate support assembly |
Wendell Glen Boyd, Jr., Vijay D. Parkhe |
2020-02-11 |
$47,813,000 |
| 10460916 |
Real time monitoring with closed loop chucking force control |
Wendell Glenn Boyd, Jr., Vijay D. Parkhe, Matthew J. Busche, Konstantin Makhratchev, Masanori Ono |
2019-10-29 |
$23,960,000 |
| 10403534 |
Pixilated cooling, temperature controlled substrate support assembly |
Vijay D. Parkhe, Wendell Glenn Boyd, Jr., Matthew J. Busche, Konstantin Makhratchev, Masanori Ono |
2019-09-03 |
$20,988,000 |
| 10121688 |
Electrostatic chuck with external flow adjustments for improved temperature distribution |
Matthew J. Busche, Vijay D. Parkhe, Wendell Glenn Boyd, Jr., Konstantin Makhratchev, Masanori Ono |
2018-11-06 |
$24,517,000 |
| 9916998 |
Substrate support assembly having a plasma resistant protective layer |
Jennifer Y. Sun, Biraja P. Kanungo, Vahid Firouzdor |
2018-03-13 |
$33,804,000 |
| 9875923 |
Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods |
Wendell Glenn Boyd, Jr., Vijay D. Parkhe, Matthew J. Busche, Konstantin Makhratchev, Masanori Ono |
2018-01-23 |
$41,300,000 |
| 9622375 |
Electrostatic chuck with external flow adjustments for improved temperature distribution |
Matthew J. Busche, Vijay D. Parkhe, Wendell Glenn Boyd, Jr., Konstantin Makhratchev, Masanori Ono |
2017-04-11 |
$31,319,000 |
| 9558981 |
Control systems employing deflection sensors to control clamping forces applied by electrostatic chucks, and related methods |
Wendell Glenn Boyd, Jr., Vijay D. Parkhe, Matthew J. Busche, Konstantin Makhratchev, Masanori Ono |
2017-01-31 |
$44,860,000 |
| 9520314 |
High temperature electrostatic chuck bonding adhesive |
Jennifer Y. Sun, Ren-Guan Duan |
2016-12-13 |
$24,422,000 |
| 9520315 |
Electrostatic chuck with internal flow adjustments for improved temperature distribution |
Vijay D. Parkhe, Matthew J. Busche, Wendell Glenn Boyd, Jr., Konstantin Makhratchev, Masanori Ono |
2016-12-13 |
$24,422,000 |
| 8941969 |
Single-body electrostatic chuck |
Dmitry Lubomirsky, Jennifer Y. Sun, Konstantin Makhratchev |
2015-01-27 |
$30,300,000 |
| 8871312 |
Method of reducing plasma arcing on surfaces of semiconductor processing apparatus components in a plasma processing chamber |
Jennifer Y. Sun, Kenneth S. Collins, Ren-Guan Duan, Thomas Graves, Xiaoming He +1 more |
2014-10-28 |
$11,517,000 |
| 8758858 |
Method of producing a plasma-resistant thermal oxide coating |
Jennifer Y. Sun, Li Xu, Kenneth S. Collins, Thomas Graves, Ren-Guan Duan |
2014-06-24 |
$13,917,000 |
| 8367227 |
Plasma-resistant ceramics with controlled electrical resistivity |
Jennifer Y. Sun, Kenneth S. Collins, Ren-Guan Duan, Thomas Graves, Xiaoming He +1 more |
2013-02-05 |
$10,826,000 |
| 8231736 |
Wet clean process for recovery of anodized chamber parts |
Jennifer Y. Sun, Xi Zhu, Li Xu, Anisul Khan |
2012-07-31 |
$11,506,000 |
| 8206829 |
Plasma resistant coatings for plasma chamber components |
Jennifer Y. Sun, Xiao-Ming He |
2012-06-26 |
$5,750,000 |
| 8129029 |
Erosion-resistant plasma chamber components comprising a metal base structure with an overlying thermal oxidation coating |
Jennifer Y. Sun, Li Xu, Kenneth S. Collins, Thomas Graves, Ren-Guan Duan |
2012-03-06 |
$9,163,000 |
| 8067067 |
Clean, dense yttrium oxide coating protecting semiconductor processing apparatus |
Jennifer Y. Sun, Jim Dempster, Li Xu |
2011-11-29 |
$8,648,000 |
| 7718029 |
Self-passivating plasma resistant material for joining chamber components |
Jennifer Y. Sun, Li Xu, Kelly A. McDonough, Robert Scott Clark |
2010-05-18 |
$6,103,000 |
| 7479304 |
Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate |
Jennifer Y. Sun, James Dempster, Li Xu, Thanh Pham |
2009-01-20 |
$19,583,000 |
| 7479464 |
Low temperature aerosol deposition of a plasma resistive layer |
Jennifer Y. Sun, Elmira Ryabova, Xi Zhu, Semyon L. Kats |
2009-01-20 |
$19,583,000 |
| 7220937 |
Plasma reactor with overhead RF source power electrode with low loss, low arcing tendency and low contamination |
Daniel Hofman, Jennifer Y. Sun, Yan Ye |
2007-05-22 |
$20,378,000 |
| 7055732 |
Semiconductor processing apparatus including plasma-resistant, welded aluminum structures |
Jennifer Y. Sun, Shun Wu, Yixing Lin, Clifford Stow |
2006-06-06 |
$30,445,000 |
| 7048814 |
Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus |
Yixing Lin, Brian T. West, Hong Wang, Shun Wu, Jennifer Y. Sun +1 more |
2006-05-23 |
$10,996,000 |
