Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437230 | Amorphous carbon multilayer coating with directional protection | Wei Wu, Feng Zhang, Xiawan Yang, Jinhan Choi | 2022-09-06 |
| 9305748 | Method of matching two or more plasma reactors | Gaurav Saraf, Xiawan Yang, Farid Abooameri, Wen Teh Chang, Bradley Scott Hersch | 2016-04-05 |
| 9236255 | Methods for forming three dimensional NAND structures atop a substrate | Sang-wook Kim, Han Soo Cho, Joo Won Han, Kee Young Cho, Kuan-Ting Liu | 2016-01-12 |
| 9184021 | Predictive method of matching two plasma reactors | Gaurav Saraf, Xiawan Yang, Farid Abooameri, Wen Teh Chang, Bradley Scott Hersch | 2015-11-10 |
| 8956500 | Methods to eliminate “M-shape” etch rate profile in inductively coupled plasma reactor | Stephen Yuen, Kyeong-Tae Lee, Valentin N. Todorow, Tae Won Kim, Shashank Deshmukh | 2015-02-17 |
| 8937021 | Methods for forming three dimensional NAND structures atop a substrate | Han Soo Cho, Sang-wook Kim, Joo Won Han, Kee Young Cho | 2015-01-20 |
| 8932947 | Methods for forming a round bottom silicon trench recess for semiconductor applications | Joo Won Han, Kee Young Cho, Han Soo Cho, Sang-wook Kim | 2015-01-13 |
| 8747684 | Multi-film stack etching with polymer passivation of an overlying etched layer | Sunil Srinivasan, Jinhan Choi | 2014-06-10 |
| 8596336 | Substrate support temperature control | Richard Fovell, Paul Brillhart, Sang In Yi, Jivko Dinev, Shane C. Nevil | 2013-12-03 |
| 8231736 | Wet clean process for recovery of anodized chamber parts | Jennifer Y. Sun, Senh Thach, Xi Zhu, Li Xu | 2012-07-31 |
| 8133817 | Shallow trench isolation etch process | Hiroki Sasano, Meihua Shen, Radhika Mani, Sunil Srinivasan, Daehee Weon +2 more | 2012-03-13 |
| 6979652 | Etching multi-shaped openings in silicon | Sharma Pamarthy, Sanjay Thekdi, Ajay Kumar | 2005-12-27 |
| 6954561 | Methods for forming thermo-optic switches, routers and attenuators | Ajay Kumar | 2005-10-11 |
| 6905616 | Method of releasing devices from a substrate | Ajay Kumar, Sanjay Thekdi, Sharma Pamarthy | 2005-06-14 |
| 6897155 | Method for etching high-aspect-ratio features | Ajay Kumar, Dragan Podlesnik, Sharma Pamarthy, Axel Henke, Stephan Wege +1 more | 2005-05-24 |
| 6827869 | Method of micromachining a multi-part cavity | Dragan Podlesnik, Thorsten Lill, Jeff Chinn, Shaoher X. Pan, Maocheng Li +1 more | 2004-12-07 |
| 6802933 | Apparatus for performing self cleaning method of forming deep trenches in silicon substrates | Ajay Kumar, Jeffrey D. Chinn, Dragan Podlesnik | 2004-10-12 |
| 6759340 | Method of etching a trench in a silicon-on-insulator (SOI) structure | Padmapani Nallan, Ajay Kumar, Chan Syun David Yang | 2004-07-06 |
| 6696365 | Process for in-situ etching a hardmask stack | Ajay Kumar, Sanjay Thekdi, Dragan Podlesnik | 2004-02-24 |
| 6642151 | Techniques for plasma etching silicon-germanium | Ajay Kumar, Padmapani Nallan | 2003-11-04 |
| 6642127 | Method for dicing a semiconductor wafer | Ajay Kumar, Padmapani Nallan, Dragan Podlesnik | 2003-11-04 |
| 6593244 | Process for etching conductors at high etch rates | Yiqiong Wang, Ajay Kumar, Dragan Podlesnik, Sharma Pamarthy | 2003-07-15 |
| 6583063 | Plasma etching of silicon using fluorinated gas mixtures | Dragan Podlesnik, Nam Hun Kim, Gene Lee | 2003-06-24 |
| 6518192 | Two etchant etch method | Ajay Kumar, Jeffrey D. Chinn, Dragan Podlesnik | 2003-02-11 |
| 6491835 | Metal mask etching of silicon | Ajay Kumar, Wei Liu, John Chao, Jeff Chinn | 2002-12-10 |