Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322602 | Recessed metal etching methods | Wangkeun Cho | 2025-06-03 |
| 12266537 | Selective barrier metal etching | Jonathan C. Shaw | 2025-04-01 |
| 12211693 | Spacer patterning process with flat top profile | Chao-Sung Li | 2025-01-28 |
| 11658043 | Selective anisotropic metal etch | Jonathan C. Shaw, Priyadarshi Panda, Nancy Fung, Yongchang Dong, Somaye Rasouli | 2023-05-23 |
| 11527408 | Multiple spacer patterning schemes | Tzu-shun Yang, Rui Cheng, Karthik Janakiraman, Zubin Huang, Diwakar Kedlaya +5 more | 2022-12-13 |
| 11315787 | Multiple spacer patterning schemes | Tzu-shun Yang, Rui Cheng, Karthik Janakiraman, Zubin Huang, Diwakar Kedlaya +5 more | 2022-04-26 |
| 10957558 | Methods of etching metal-containing layers | Akhil Mehrotra, Abhijit Patil, Shan Jiang, Zohreh Hesabi | 2021-03-23 |
| 10636675 | Methods of etching metal-containing layers | Akhil Mehrotra, Abhijit Patil, Shan Jiang, Zohreh Hesabi | 2020-04-28 |
| 9852923 | Mask etch for patterning | Lucy Chen | 2017-12-26 |
| 9595451 | Highly selective etching methods for etching dielectric materials | Hailong Zhou, Liming Yang | 2017-03-14 |
| 9299580 | High aspect ratio plasma etch for 3D NAND semiconductor applications | Byungkook Kong, Liming Yang | 2016-03-29 |
| 9054045 | Method for isotropic etching | Nicolas Posseme | 2015-06-09 |
| 8658541 | Method of controlling trench microloading using plasma pulsing | Chansyun David Yang, Liming Yang | 2014-02-25 |
| 6583063 | Plasma etching of silicon using fluorinated gas mixtures | Anisul Khan, Dragan Podlesnik, Nam Hun Kim | 2003-06-24 |
| 6235643 | Method for etching a trench having rounded top and bottom corners in a silicon substrate | David Mui, Dragan Podlesnik, Wei Liu, Nam Hun Kim, Jeff Chinn | 2001-05-22 |