| 12341048 |
Porous plug for electrostatic chuck gas delivery |
Alexander SULYMAN, Xue Yang Chang, Timothy Joseph Franklin, Joseph F. Sommers |
2025-06-24 |
|
| 12211734 |
Lift pin mechanism |
Alexander SULYMAN, Carlaton WONG, Rajinder Dhindsa, Timothy Joseph Franklin, Steven E. Babayan +2 more |
2025-01-28 |
|
| 12198903 |
Plasma resistant arc preventative coatings for manufacturing equipment components |
Joseph F. Sommers, Joseph Behnke, Xue Yang Chang, Alexander SULYMAN, Timothy Joseph Franklin +1 more |
2025-01-14 |
|
| 12020977 |
Lift pin assembly |
Alexander SULYMAN, Timothy Joseph Franklin, Carlaton WONG, Xue Yang Chang |
2024-06-25 |
$57,214,000 |
| 11551960 |
Helical plug for reduction or prevention of arcing in a substrate support |
Reyn Tetsuro WAKABAYASHI, Hamid Noorbakhsh |
2023-01-10 |
$38,290,000 |
| 11551916 |
Sheath and temperature control of a process kit in a substrate processing chamber |
Jaeyong Cho, Rajinder Dhindsa, James Rogers |
2023-01-10 |
$38,290,000 |
| 11543954 |
Scroll activity detection for selection and display of information |
— |
2023-01-03 |
|
| 11488852 |
Methods and apparatus for reducing high voltage arcing in semiconductor process chambers |
Hamid Noorbakhsh, Kartik Ramaswamy |
2022-11-01 |
$32,150,000 |
| 11424096 |
Temperature controlled secondary electrode for ion control at substrate edge |
Hamid Noorbakhsh, Kartik Ramaswamy |
2022-08-23 |
$37,610,000 |
| 11171030 |
Methods and apparatus for dechucking wafers |
Hamid Noorbakhsh, Haitao Wang, Sergio Fukuda Shoji |
2021-11-09 |
$68,627,000 |
| 10930540 |
Electrostatic chuck assembly having a dielectric filler |
Kartik Ramaswamy, Haitao Wang, Evans Lee, Jaeyong Cho, Hamid Noorbakhsh +3 more |
2021-02-23 |
$34,793,000 |
| 10847347 |
Edge ring assembly for a substrate support in a plasma processing chamber |
Hamid Noorbakhsh, Reyn Tetsuro WAKABAYASHI |
2020-11-24 |
$38,395,000 |
| 10504765 |
Electrostatic chuck assembly having a dielectric filler |
Kartik Ramaswamy, Haitao Wang, Evans Lee, Jaeyong Cho, Hamid Noorbakhsh +3 more |
2019-12-10 |
$14,920,000 |
| 9905402 |
Plasma processing chamber with a grounded electrode assembly |
Arnold Kholodenko |
2018-02-27 |
$105,153,000 |
| 8739805 |
Confinement of foam delivered by a proximity head |
Arnold Kholodenko, Cheng-Yu Lin, Leon Ginzburg, Mark Mandelboym, Gregory A. Tomasch |
2014-06-03 |
$19,987,000 |
| 8584613 |
Single substrate processing head for particle removal using low viscosity fluid |
Arnold Kholodenko, Cheng-Yu Lin, Leon Ginzburg, Mark Mandelboym, Gregory A. Tomasch |
2013-11-19 |
$6,432,000 |
| 8557051 |
Method for using generator for foam to clean substrate |
Arnold Kholodenko, Gregory A. Tomasch, Cheng-Yu Lin |
2013-10-15 |
$21,702,000 |
| 8261905 |
Wafer carrier drive apparatus and method for operating the same |
Arnold Kholodenko, George Khait |
2012-09-11 |
$5,557,000 |
| 8161984 |
Generator for foam to clean substrate |
Arnold Kholodenko, Gregory A. Tomasch, Cheng-Yu Lin |
2012-04-24 |
$7,669,000 |
| 7743730 |
Apparatus for an optimized plasma chamber grounded electrode assembly |
Arnold Kholodenko |
2010-06-29 |
$17,114,000 |
| 7226514 |
Spin-rinse-dryer |
Brian J. Brown, David G. Andeen, Svetlana Sherman, John M. White, Michael Sugarman +2 more |
2007-06-05 |
$16,579,000 |
| 6575177 |
Semiconductor substrate cleaning system |
Brian J. Brown, Fred C. Redeker |
2003-06-10 |
$35,747,000 |
| 6516816 |
Spin-rinse-dryer |
Brian J. Brown, David G. Andeen, Svetlana Sherman, John M. White, Michael Sugarman +2 more |
2003-02-11 |
$17,783,000 |
| 6474712 |
Gripper for supporting substrate in a vertical orientation |
Boris Govzman, Manoocher Birang, Michael Sugarman |
2002-11-05 |
$31,691,000 |
| 6406359 |
Apparatus for transferring semiconductor substrates using an input module |
Manoocher Birang, Brian J. Brown, Michael Sugarman |
2002-06-18 |
$32,418,000 |
