| 9208998 |
Multi-station decoupled reactive ion etch chamber |
Gerald Yin, Tuqiang Ni, Jinyuan Chen |
2015-12-08 |
| 8366829 |
Multi-station decoupled reactive ion etch chamber |
Gerald Yin, Tuqiang Ni, Jinyuan Chen |
2013-02-05 |
| 7503996 |
Multiple frequency plasma chamber, switchable RF system, and processes using same |
Jinyuan Chen, Gerald Yin, Tuqiang Ni, Hiroshi Iizuka |
2009-03-17 |
| 6808647 |
Methodologies to reduce process sensitivity to the chamber condition |
Songlin Xu, Zhiwen Sun, Dragan Podlesnik |
2004-10-26 |
| 6635578 |
Method of operating a dual chamber reactor with neutral density decoupled from ion density |
Songlin Xu, John Holland |
2003-10-21 |
| 6544896 |
Method for enhancing etching of TiSix |
Songlin Xu, Takakazu Kusuki |
2003-04-08 |
| 6447637 |
Process chamber having a voltage distribution electrode |
Valentin Todorov, Robert E. Ryan, Arthur H. Sato, Jin-Yuan Chen, Zhiwen Sun |
2002-09-10 |
| 6367410 |
Closed-loop dome thermal control apparatus for a semiconductor wafer processing system |
Patrick Leahey, Jerry Chen, Richard E. Remington, Simon Yavelberg, Timothy D. Driscoll +3 more |
2002-04-09 |
| 5540800 |
Inductively coupled high density plasma reactor for plasma assisted materials processing |
— |
1996-07-30 |
