| 8252699 |
Composite removable hardmask |
Josephine Juhwei Liu, Deenesh Padhi, Bok Hoen Kim, William H. McClintock |
2012-08-28 |
| 6660650 |
Selective aluminum plug formation and etchback process |
Wei-Yung Hsu, Qi-Zhong Hong |
2003-12-09 |
| 6589865 |
Low pressure, low temperature, semiconductor gap filling process |
Girish Dixit, Robert H. Havemann |
2003-07-08 |
| 6455419 |
System and method of forming a tungsten plug |
Srikanth Bolnedi |
2002-09-24 |
| 6355558 |
Metallization structure, and associated method, to improve crystallographic texture and cavity fill for CVD aluminum/PVD aluminum alloy films |
Girish Dixit |
2002-03-12 |
| 6333265 |
Low pressure, low temperature, semiconductor gap filling process |
Girish Dixit, Robert H. Havemann |
2001-12-25 |
| 6291347 |
Method and system for constructing semiconductor devices |
Noel Russell |
2001-09-18 |
| 6215186 |
System and method of forming a tungstein plug |
Srikanth Bolnedi |
2001-04-10 |
| 6069072 |
CVD tin barrier layer for reduced electromigration of aluminum plugs |
Girish Dixit |
2000-05-30 |
| 5981382 |
PVD deposition process for CVD aluminum liner processing |
Noel Russell |
1999-11-09 |
| 5926689 |
Process for reducing circuit damage during PECVD in single wafer PECVD system |
Donna R. Cote, John C. Forster, Virinder Grewal, Dragan Podlesnik |
1999-07-20 |
| 5849367 |
Elemental titanium-free liner and fabrication process for inter-metal connections |
Girish Dixit |
1998-12-15 |
