RH

Robert H. Havemann

TI Texas Instruments: 70 patents #78 of 12,488Top 1%
NS Novellus Systems: 7 patents #125 of 780Top 20%
Overall (All Time): #23,949 of 4,157,543Top 1%
78
Patents All Time

Issued Patents All Time

Showing 25 most recent of 78 patents

Patent #TitleCo-InventorsDate
8039379 Nanoparticle cap layer Glenn B. Alers 2011-10-18
7994640 Nanoparticle cap layer Glenn B. Alers 2011-08-09
7368401 Integrated circuit having a doped porous dielectric and method of manufacturing the same 2008-05-06
7157798 Selective refractory metal and nitride capping James A. Fair, Jungwan Sung, Nerissa Taylor, Sang-Hyeob Lee, Mary Anne Plano 2007-01-02
6995439 Method of fabricating low dielectric constant dielectric films Richard S. Hill, Willibrordus Gerardus Maria van den Hoek 2006-02-07
6873026 Inhomogeneous materials having physical properties decoupled from desired functions Paul E. Brunemeier, Archita Sengupta, Justin Gaynor 2005-03-29
6844258 Selective refractory metal and nitride capping James A. Fair, Jungwan Sung, Nerissa Taylor, Sang-Hyeob Lee, Mary Anne Plano 2005-01-18
6753250 Method of fabricating low dielectric constant dielectric films Richard S. Hill, Willibrordus Gerardus Maria van den Hoek 2004-06-22
6753563 Integrated circuit having a doped porous dielectric and method of manufacturing the same 2004-06-22
6677188 Methods for forming a fuse in a semiconductor device 2004-01-13
6589865 Low pressure, low temperature, semiconductor gap filling process Girish Dixit, Anthony Konecni 2003-07-08
6566211 Surface modified interconnects Carole D. Graas 2003-05-20
6372596 Method of making horizontal bipolar transistor with insulated base structure 2002-04-16
6365451 Transistor and method 2002-04-02
6358849 Integrated circuit interconnect and method Girish Dixit, Manoj Kumar Jain, Eden Zielinski, Qi-Zhong Hong, Jeffrey Alan West 2002-03-19
6355983 Surface modified interconnects Carole D. Graas 2002-03-12
6355559 Passivation of inlaid metallization Qi-Zhong Hong, Girish Dixit 2002-03-12
6333265 Low pressure, low temperature, semiconductor gap filling process Girish Dixit, Anthony Konecni 2001-12-25
6278174 Integrated circuit insulator and structure using low dielectric insulator material including HSQ and fluorinated oxide Manoj Kumar Jain 2001-08-21
6271577 Transistor and method 2001-08-07
6261915 Process of making polysilicon resistor Robert H. Eklund, Leo Stroth 2001-07-17
6248638 Enhancements to polysilicon gate 2001-06-19
6245672 Method of forming diffusion barriers for copper metallization in integrated cirucits Qi-Zhong Hong, Wei-Yung Hsu, Jiong-Ping Lu 2001-06-12
6188125 Via formation in polymeric materials 2001-02-13
6159847 Multilayer metal structure for improved interconnect reliability Girish Dixit 2000-12-12