| 8039379 |
Nanoparticle cap layer |
Glenn B. Alers |
2011-10-18 |
$15,576,000 |
| 7994640 |
Nanoparticle cap layer |
Glenn B. Alers |
2011-08-09 |
$7,480,000 |
| 7368401 |
Integrated circuit having a doped porous dielectric and method of manufacturing the same |
— |
2008-05-06 |
$23,914,000 |
| 7157798 |
Selective refractory metal and nitride capping |
James A. Fair, Jungwan Sung, Nerissa Taylor, Sang-Hyeob Lee, Mary Anne Plano |
2007-01-02 |
|
| 6995439 |
Method of fabricating low dielectric constant dielectric films |
Richard S. Hill, Willibrordus Gerardus Maria van den Hoek |
2006-02-07 |
$26,826,000 |
| 6873026 |
Inhomogeneous materials having physical properties decoupled from desired functions |
Paul E. Brunemeier, Archita Sengupta, Justin Gaynor |
2005-03-29 |
$14,395,000 |
| 6844258 |
Selective refractory metal and nitride capping |
James A. Fair, Jungwan Sung, Nerissa Taylor, Sang-Hyeob Lee, Mary Anne Plano |
2005-01-18 |
$15,127,000 |
| 6753250 |
Method of fabricating low dielectric constant dielectric films |
Richard S. Hill, Willibrordus Gerardus Maria van den Hoek |
2004-06-22 |
$20,046,000 |
| 6753563 |
Integrated circuit having a doped porous dielectric and method of manufacturing the same |
— |
2004-06-22 |
$14,063,000 |
| 6677188 |
Methods for forming a fuse in a semiconductor device |
— |
2004-01-13 |
$28,885,000 |
| 6589865 |
Low pressure, low temperature, semiconductor gap filling process |
Girish Dixit, Anthony Konecni |
2003-07-08 |
$23,364,000 |
| 6566211 |
Surface modified interconnects |
Carole D. Graas |
2003-05-20 |
$20,266,000 |
| 6372596 |
Method of making horizontal bipolar transistor with insulated base structure |
— |
2002-04-16 |
$26,461,000 |
| 6365451 |
Transistor and method |
— |
2002-04-02 |
$33,186,000 |
| 6358849 |
Integrated circuit interconnect and method |
Girish Dixit, Manoj Kumar Jain, Eden Zielinski, Qi-Zhong Hong, Jeffrey Alan West |
2002-03-19 |
$101,176,000 |
| 6355983 |
Surface modified interconnects |
Carole D. Graas |
2002-03-12 |
$60,388,000 |
| 6355559 |
Passivation of inlaid metallization |
Qi-Zhong Hong, Girish Dixit |
2002-03-12 |
$60,388,000 |
| 6333265 |
Low pressure, low temperature, semiconductor gap filling process |
Girish Dixit, Anthony Konecni |
2001-12-25 |
|
| 6278174 |
Integrated circuit insulator and structure using low dielectric insulator material including HSQ and fluorinated oxide |
Manoj Kumar Jain |
2001-08-21 |
$63,861,000 |
| 6271577 |
Transistor and method |
— |
2001-08-07 |
$77,130,000 |
| 6261915 |
Process of making polysilicon resistor |
Robert H. Eklund, Leo Stroth |
2001-07-17 |
$46,170,000 |
| 6248638 |
Enhancements to polysilicon gate |
— |
2001-06-19 |
$43,385,000 |
| 6245672 |
Method of forming diffusion barriers for copper metallization in integrated cirucits |
Qi-Zhong Hong, Wei-Yung Hsu, Jiong-Ping Lu |
2001-06-12 |
$38,888,000 |
| 6188125 |
Via formation in polymeric materials |
— |
2001-02-13 |
$55,093,000 |
| 6159847 |
Multilayer metal structure for improved interconnect reliability |
Girish Dixit |
2000-12-12 |
$99,350,000 |