Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6332569 | Etched glass solder bump transfer for flip chip integrated circuit devices | Steven A. Cordes, Peter A. Gruber, Stephen Roux, Carlos J. Sambucetti, James L. Speidell | 2001-12-25 |
| 6231333 | Apparatus and method for vacuum injection molding | Peter A. Gruber, Bernie Hernandez, Thomas G. Ference, Arthur R. Zingher | 2001-05-15 |
| 6105852 | Etched glass solder bump transfer for flip chip integrated circuit devices | Steven A. Cordes, Peter A. Gruber, Stephen Roux, Carlos J. Sambucetti, James L. Speidell | 2000-08-22 |