Issued Patents All Time
Showing 76–100 of 121 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6924171 | Bilayer wafer-level underfill | Stephen L. Buchwalter, David Danovitch, Fuad E. Doany, Claudius Feger, Revathi Iyengar +1 more | 2005-08-02 |
| 6910615 | Solder reflow type electrical apparatus packaging having integrated circuit and discrete components | Minkailu A Jalloh, Chon Cheong Lei | 2005-06-28 |
| 6832747 | Hybrid molds for molten solder screening process | Steven A. Cordes, David Danovitch, James L. Speidell, Joseph Zinter | 2004-12-21 |
| 6708873 | Apparatus and method for filling high aspect ratio via holes in electronic substrates | Frederic Maurer, Lubomyr T. Romankiw | 2004-03-23 |
| 6708872 | Method and apparatus for applying solder to an element on a substrate | Chon Cheong Lei | 2004-03-23 |
| 6656750 | Method for testing chips on flat solder bumps | Madhav Datta, Judith M. Rubino, Carlos J. Sambucetti, George F. Walker | 2003-12-02 |
| 6581280 | Method for filling high aspect ratio via holes in electronic substrates | Brian E. Curcio, Frederic Maurer, Konstantinos I. Papathomas, Mark D. Poliks | 2003-06-24 |
| 6566612 | Method for direct chip attach by solder bumps and an underfill layer | Guy Paul Brouillette, David Danovitch, Michael Liehr, Carlos J. Sambucetti | 2003-05-20 |
| 6534863 | Common ball-limiting metallurgy for I/O sites | George F. Walker, Ronald D. Goldblatt, Raymond R. Horton, Kevin S. Petrarca, Richard P. Volant +1 more | 2003-03-18 |
| 6527158 | Method and apparatus for forming solder bumps | Guy Paul Brouillette, Frederic Maurer | 2003-03-04 |
| 6461136 | Apparatus for filling high aspect ratio via holes in electronic substrates | Frederic Maurer, Lubomyr T. Romankiw | 2002-10-08 |
| 6452117 | Method for filling high aspect ratio via holes in electronic substrates and the resulting holes | Brian E. Curcio, Frederic Maurer, Konstantinos I. Papathomas, Mark D. Poliks | 2002-09-17 |
| 6425518 | Method and apparatus for applying solder to an element on a substrate | Chon Cheong Lei | 2002-07-30 |
| 6426241 | Method for forming three-dimensional circuitization and circuits formed | Steven A. Cordes, James L. Speidell, Wayne J. Howell, Thomas G. Ference | 2002-07-30 |
| 6394334 | Method and apparatus for forming solder bumps | Guy Paul Brouillette, Frederic Maurer | 2002-05-28 |
| 6390439 | Hybrid molds for molten solder screening process | Steven A. Cordes, David Danovitch, James L. Speidell, Joseph Zinter | 2002-05-21 |
| 6362557 | Ultrasonic method and actuator for inducing motion of an object | Frederic Maurer, George F. Walker | 2002-03-26 |
| 6341418 | Method for direct chip attach by solder bumps and an underfill layer | Guy Paul Brouillette, David Danovitch, Michael Liehr, Carlos J. Sambucetti | 2002-01-29 |
| 6340630 | Method for making interconnect for low temperature chip attachment | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Bruce Lee Humphrey, Michael Liehr +2 more | 2002-01-22 |
| 6332569 | Etched glass solder bump transfer for flip chip integrated circuit devices | Steven A. Cordes, Egon Max Kummer, Stephen Roux, Carlos J. Sambucetti, James L. Speidell | 2001-12-25 |
| 6294745 | Solder anchor decal | — | 2001-09-25 |
| 6276596 | Low temperature solder column attach by injection molded solder and structure formed | Lannie R. Bolde, Guy Paul Brouillette, James H. Covell, David Danovitch, Chon Cheong Lei | 2001-08-21 |
| 6231333 | Apparatus and method for vacuum injection molding | Egon Max Kummer, Bernie Hernandez, Thomas G. Ference, Arthur R. Zingher | 2001-05-15 |
| 6153505 | Plastic solder array using injection molded solder | Lannie R. Bolde, Chon Cheong Lei | 2000-11-28 |
| 6149122 | Method for building interconnect structures by injection molded solder and structures built | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Rajesh Shankerlal Patel, Stephen Roux +2 more | 2000-11-21 |