Issued Patents All Time
Showing 26–50 of 121 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8408448 | Forming constant diameter spherical metal balls | Claudius Feger, Mark H. McLeod, Jae-Woong Nah | 2013-04-02 |
| 8381962 | Injection molded solder method for forming solder bumps on substrates | Paul A. Lauro, Jae-Woong Nah, Kazushige Toriyama | 2013-02-26 |
| 8376207 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Paul A. Lauro, Jae-Woong Nah | 2013-02-19 |
| 8342387 | Spherical solder reflow method | Jae-Woong Nah | 2013-01-01 |
| 8328156 | Techniques for forming solder bump interconnects | Bing Dang, Luc Guerin, Chirag S. Patel | 2012-12-11 |
| 8272120 | Apparatus for applying solder to semiconductor chips using decals with aperatures present therein | Jae-Woong Nah | 2012-09-25 |
| 8268719 | Sprocket opening alignment process and apparatus for multilayer solder decal | Stephen L. Buchwalter, Jae-Woong Nah, Da-Yuan Shih | 2012-09-18 |
| 8242010 | Electrical interconnect forming method | Stephen L. Buchwalter, Bruce K. Furman, Jae-Woong Nah, Da-Yuan Shih | 2012-08-14 |
| 8237271 | Direct edge connection for multi-chip integrated circuits | Steven A. Cordes, Matthew J. Farinelli, Sherif A. Goma, John U. Knickerbocker, James L. Speidell | 2012-08-07 |
| 8162203 | Spherical solder reflow method | Jae-Woong Nah | 2012-04-24 |
| 8162200 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Paul A. Lauro, Jae-Woong Nah | 2012-04-24 |
| 8162199 | Mold shave apparatus and injection molded soldering process | Eric E. Bourchard, Guy Paul Brouillette, David Danovitch, Jean-Luc Landreville | 2012-04-24 |
| 8157158 | Modification of solder alloy compositions to suppress interfacial void formation in solder joints | Donald W. Henderson, Sung Kwon Kang, Da-Yuan Shih | 2012-04-17 |
| 8148255 | Techniques for forming solder bump interconnects | Bing Dang, Luc Guerin, Chirag S. Patel | 2012-04-03 |
| 8136714 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Paul A. Lauro, Jae-Woong Nah | 2012-03-20 |
| 8138020 | Wafer level integrated interconnect decal and manufacturing method thereof | Jae-Woong Nah | 2012-03-20 |
| 8117982 | Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold | John U. Knickerbocker | 2012-02-21 |
| 8104668 | Method and apparatus providing fine alignment of a structure relative to a support | Philip Charles Danby Hobbs | 2012-01-31 |
| 8053283 | Die level integrated interconnect decal manufacturing method and apparatus | Jae-Woong Nah | 2011-11-08 |
| 8011563 | Compliant mold fill head with integrated cavity venting and solder cooling | Russell A. Budd, Evan G. Colgan, Gareth G. Hougham, John P. Karidis | 2011-09-06 |
| 7980446 | Micro-fluidic injection molded solder (IMS) | Stephen L. Buchwalter, Paul A. Lauro, Jae-Woong Nah | 2011-07-19 |
| 7955966 | Injection molded solder ball method | Barry A. Hochlowski, David T. Naugle | 2011-06-07 |
| 7931187 | Injection molded solder method for forming solder bumps on substrates | Paul A. Lauro, Jae-Woong Nah, Kazushige Toriyama | 2011-04-26 |
| 7928585 | Sprocket opening alignment process and apparatus for multilayer solder decal | Stephen L. Buchwalter, Jae-Woong Nah, Da-Yuan Shih | 2011-04-19 |
| 7906420 | Method and apparatus for forming planar alloy deposits on a substrate | Paul A. Lauro, Jae-Woong Nah | 2011-03-15 |