Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9498837 | Vacuum transition for solder bump mold filling | John J. Garant, Robert Haas, Phillip W. Palmatier | 2016-11-22 |
| 9278401 | Fill head interface with combination vacuum pressure chamber | Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John J. Garant, Peter A. Gruber +5 more | 2016-03-08 |
| 7401637 | Pressure-only molten metal valving apparatus and method | Glen N. Biggs, John J. Garant, Peter A. Gruber, Christopher L. Tessler, Thomas Weiss | 2008-07-22 |
| 6678949 | Process for forming a multi-level thin-film electronic packaging structure | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more | 2004-01-20 |
| 6448169 | Apparatus and method for use in manufacturing semiconductor devices | William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Arthur G. Merryman +4 more | 2002-09-10 |
| 6281452 | Multi-level thin-film electronic packaging structure and related method | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more | 2001-08-28 |
| 6149048 | Apparatus and method for use in manufacturing semiconductor devices | William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Arthur G. Merryman +4 more | 2000-11-21 |
| 6099935 | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices | William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Arthur G. Merryman +4 more | 2000-08-08 |
| 5905566 | Laser ablation top surface reference chuck | Ralph R. Comulada, Jr., Christopher L. Tessler | 1999-05-18 |
| 5722579 | Bottom-surface-metallurgy rework process in ceramic modules | Roy Yu, James Wood, Thomas Michael Biruk, Gregory S. Boettcher, William Brearley +2 more | 1998-03-03 |