Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6678949 | Process for forming a multi-level thin-film electronic packaging structure | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more | 2004-01-20 |
| 6632314 | Method of making a lamination and surface planarization for multilayer thin film interconnect | RongQing Yu, Chandrika Prasad, Sung Kwon Kang, Sampath Purushothaman | 2003-10-14 |
| 6455331 | Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Yeeling L. Lee +3 more | 2002-09-24 |
| 6448169 | Apparatus and method for use in manufacturing semiconductor devices | William Brearley, Laertis Economikos, Paul F. Findeis, Bouwe W. Leenstra, Arthur G. Merryman +4 more | 2002-09-10 |
| 6281452 | Multi-level thin-film electronic packaging structure and related method | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more | 2001-08-28 |
| 6248599 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Yeeling L. Lee +3 more | 2001-06-19 |
| 6183588 | Process for transferring a thin-film structure to a substrate | Ashwani K. Malhotra, Eric D. Perfecto, Roy Yu | 2001-02-06 |
| 6149048 | Apparatus and method for use in manufacturing semiconductor devices | William Brearley, Laertis Economikos, Paul F. Findeis, Bouwe W. Leenstra, Arthur G. Merryman +4 more | 2000-11-21 |
| 6143117 | Process for transferring a thin-film structure to a temporary carrier | Ashwani K. Malhotra, Eric D. Perfecto, Roy Yu | 2000-11-07 |
| 6099935 | Apparatus for providing solder interconnections to semiconductor and electronic packaging devices | William Brearley, Laertis Economikos, Paul F. Findeis, Bouwe W. Leenstra, Arthur G. Merryman +4 more | 2000-08-08 |
| 6048741 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Yeeling L. Lee +3 more | 2000-04-11 |
| 6036809 | Process for releasing a thin-film structure from a substrate | Ashwani K. Malhotra, Eric D. Perfecto, Roy Yu | 2000-03-14 |
| 5735452 | Ball grid array by partitioned lamination process | Roy Yu, William Brearley, Patrick M. O'Leary, Arthur G. Merryman, James Wood | 1998-04-07 |
| 5722579 | Bottom-surface-metallurgy rework process in ceramic modules | Roy Yu, James Wood, Thomas Michael Biruk, Gregory S. Boettcher, William Brearley +2 more | 1998-03-03 |