| 6678949 |
Process for forming a multi-level thin-film electronic packaging structure |
Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more |
2004-01-20 |
$10,094,000 |
| 6632314 |
Method of making a lamination and surface planarization for multilayer thin film interconnect |
RongQing Yu, Chandrika Prasad, Sung Kwon Kang, Sampath Purushothaman |
2003-10-14 |
$12,688,000 |
| 6455331 |
Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Yeeling L. Lee +3 more |
2002-09-24 |
$8,983,000 |
| 6448169 |
Apparatus and method for use in manufacturing semiconductor devices |
William Brearley, Laertis Economikos, Paul F. Findeis, Bouwe W. Leenstra, Arthur G. Merryman +4 more |
2002-09-10 |
$13,066,000 |
| 6281452 |
Multi-level thin-film electronic packaging structure and related method |
Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more |
2001-08-28 |
$18,210,000 |
| 6248599 |
Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Yeeling L. Lee +3 more |
2001-06-19 |
$38,179,000 |
| 6183588 |
Process for transferring a thin-film structure to a substrate |
Ashwani K. Malhotra, Eric D. Perfecto, Roy Yu |
2001-02-06 |
$23,051,000 |
| 6149048 |
Apparatus and method for use in manufacturing semiconductor devices |
William Brearley, Laertis Economikos, Paul F. Findeis, Bouwe W. Leenstra, Arthur G. Merryman +4 more |
2000-11-21 |
$39,339,000 |
| 6143117 |
Process for transferring a thin-film structure to a temporary carrier |
Ashwani K. Malhotra, Eric D. Perfecto, Roy Yu |
2000-11-07 |
$39,779,000 |
| 6099935 |
Apparatus for providing solder interconnections to semiconductor and electronic packaging devices |
William Brearley, Laertis Economikos, Paul F. Findeis, Bouwe W. Leenstra, Arthur G. Merryman +4 more |
2000-08-08 |
$34,993,000 |
| 6048741 |
Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Yeeling L. Lee +3 more |
2000-04-11 |
$38,584,000 |
| 6036809 |
Process for releasing a thin-film structure from a substrate |
Ashwani K. Malhotra, Eric D. Perfecto, Roy Yu |
2000-03-14 |
$26,705,000 |
| 5735452 |
Ball grid array by partitioned lamination process |
Roy Yu, William Brearley, Patrick M. O'Leary, Arthur G. Merryman, James Wood |
1998-04-07 |
$12,123,000 |
| 5722579 |
Bottom-surface-metallurgy rework process in ceramic modules |
Roy Yu, James Wood, Thomas Michael Biruk, Gregory S. Boettcher, William Brearley +2 more |
1998-03-03 |
$13,090,000 |