Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices

Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices

US Patent 6048741 · Granted Apr 11, 2000

Estimated economic value: $38,584,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi chip hardware security module2024
High bandwidth module2023
Four D device process and structure2022
High bandwidth module2021
Flip chip packaging rework2021
Lead-free solder joining of electronic structures2021
Mitigating cracking within integrated circuit (IC) device carrier2021
Compressive zone to reduce dicing defects2020
Precision alignment of multi-chip high density interconnects2020
Integrated circuit defect detection using pattern images2020
Step pyramid shaped structure to reduce dicing defects2020
Lead-free solder joining of electronic structures2020