Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6455331 | Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more | 2002-09-24 |
| 6248599 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more | 2001-06-19 |
| 6048741 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more | 2000-04-11 |