Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6669833 | Process and apparatus for electroplating microscopic features uniformly across a large substrate | Suryanarayana Kaja, Chandrika Prasad | 2003-12-30 |
| 6632314 | Method of making a lamination and surface planarization for multilayer thin film interconnect | Kimberley A. Kelly, Chandrika Prasad, Sung Kwon Kang, Sampath Purushothaman | 2003-10-14 |
| 6329609 | Method and structure to prevent distortion and expansion of organic spacer layer for thin film transfer-join technology | Suryanarayana Kaja, Chandrika Prasad | 2001-12-11 |