Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002835 | Structure for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma, Eric D. Perfecto | 2018-06-19 |
| 9953900 | Transistor structures gated using a conductor-filled via or trench | John M. Safran, Sami Rosenblatt, Chandrasekharan Kothandaraman | 2018-04-24 |
| 9607973 | Method for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma, Eric D. Perfecto | 2017-03-28 |
| 8645875 | Method for quantifying the manufacturing complexity of electrical designs | Richard P. Surprenant | 2014-02-04 |
| 7873936 | Method for quantifying the manufactoring complexity of electrical designs | Richard P. Surprenant | 2011-01-18 |
| 7325213 | Nested design approach | Harsaran S. Bhatia, Marie Cole, Jason L. Frankel, Eric V. Kline, Kenneth A. Papae +1 more | 2008-01-29 |
| 7088000 | Method and structure to wire electronic devices | Michael J. Domitrovits, Benjamin V. Fasano, Harvey C. Hamel, Charles T. Ryan | 2006-08-08 |
| 6676784 | Process for the manufacture of multilayer ceramic substrates | Christopher D. Setzer, Harsaran S. Bahatia, Raymond Morris Bryant, Suresh D. Kadakia, Richard O. Seeger +1 more | 2004-01-13 |