LH

Li-Wen Hung

IBM: 59 patents #1,342 of 70,183Top 2%
IN Invensense: 5 patents #103 of 391Top 30%
University of California: 1 patents #8,022 of 18,278Top 45%
Overall (All Time): #33,754 of 4,157,543Top 1%
65
Patents All Time

Issued Patents All Time

Showing 25 most recent of 65 patents

Patent #TitleCo-InventorsDate
12185644 Quantum circuit with trench capacitor Elbert E. Huang, Harry Jonathon Mamin, Daniel Rugar, Martin O. Sandberg, Joseph Finley 2024-12-31
11797851 Inference focus for offline training of SRAM inference engine in binary neural network Chia-Yu Chen, Jui-Hsin Lai, Ko-Tao Lee 2023-10-24
11599785 Inference focus for offline training of SRAM inference engine in binary neural network Chia-Yu Chen, Jui-Hsin Lai, Ko-Tao Lee 2023-03-07
11424152 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia K. Tsang 2022-08-23
11222862 High speed handling of ultra-small chips by selective laser bonding and debonding Qianwen Chen, Bing Dang, Russell A. Budd, Bo Wen, Jae-Woong Nah +1 more 2022-01-11
11201138 Wafer level integration including design/co-design, structure process, equipment stress management and thermal management Bing Dang, John U. Knickerbocker, Jae-Woong Nah 2021-12-14
11158781 Permanent wafer handlers with through silicon vias for thermalization and qubit modification Jae-Woong Nah, Eric P. Lewandowski, Adinath S. Narasgond 2021-10-26
11121005 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia Tsang Yang 2021-09-14
11094407 Electronics miniaturization platform for medication verification and tracking John U. Knickerbocker, Bing Dang, Katsuyuki Sakuma, Jeffrey D. Gelorme, Rajeev Narayanan +1 more 2021-08-17
11055459 Heterogeneous miniaturization platform Qianwen Chen, Wanki Kim, John U. Knickerbocker, Kenneth P. Rodbell, Robert L. Wisnieff 2021-07-06
11043301 Infrared detectors and thermal tags for real-time activity monitoring Jui-Hsin Lai 2021-06-22
10940554 Planar fabrication of micro-needles Jui-Hsin Lai, Chia-Yu Chen, Ko-Tao Lee 2021-03-09
10835156 Thermal tags for real-time activity monitoring and methods for fabricating the same Jui-Hsin Lai 2020-11-17
10833048 Nanowire enabled substrate bonding and electrical contact formation Reinaldo Vega, Hari V. Mallela 2020-11-10
10811413 Multi-threshold vertical FETs with common gates Takashi Ando, Reinaldo Vega, Choonghyun Lee, Hari V. Mallela 2020-10-20
10811305 Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management John U. Knickerbocker, Leathen Shi, Cornelia Tsang Yang, Bucknell C. Webb 2020-10-20
10770512 Stacked resistive random access memory with integrated access transistor and high density layout Reinaldo Vega, Takashi Ando, Hari V. Mallela 2020-09-08
10740667 Temperature triggered switch Jae-Woong Nah 2020-08-11
10679887 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia Tsang Yang 2020-06-09
10658182 Chip handling and electronic component integration Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker 2020-05-19
10651134 Wafer level integration including design/co-design, structure process, equipment stress management and thermal management Jeffrey D. Gelorme, John U. Knickerbocker 2020-05-12
10651036 Chip handling and electronic component integration Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker 2020-05-12
10586726 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia Tsang Yang 2020-03-10
10579583 True random generator (TRNG) in ML accelerators for NN dropout and initialization Chia-Yu Chen, Pierce I-Jen Chuang, Jui-Hsin Lai 2020-03-03
10573538 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia Tsang Yang 2020-02-25