CY

Cornelia Tsang Yang

IBM: 17 patents #6,502 of 70,183Top 10%
Johnson & Johnson: 2 patents #3,442 of 7,810Top 45%
Overall (All Time): #271,278 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11529627 Layered silicon and stacking of microfluidic chips Joshua T. Smith, Benjamin H. Wunsch 2022-12-20
11258132 Microbattery separator Paul S. Andry, Eric P. Lewandowski, Adam Toner, Daniel B. Otts, James Daniel Riall 2022-02-22
11121005 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker 2021-09-14
10702866 Layered silicon and stacking of microfluidic chips Joshua T. Smith, Benjamin H. Wunsch 2020-07-07
10679887 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker 2020-06-09
10586726 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker 2020-03-10
10573538 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker 2020-02-25
10388929 Microbattery separator Paul S. Andry, Eric P. Lewandowski, Adam Toner, Daniel B. Otts, James Daniel Riall 2019-08-20
10325785 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker 2019-06-18
10276439 Rapid oxide etch for manufacturing through dielectric via structures Sebastian U. Engelmann, Li-Wen Hung, Eric A. Joseph, Eugene J. O'Sullivan, Jeff Waksman 2019-04-30
10232372 Integrated nanofluidic arrays for high capacity colloid separation Joshua T. Smith, Benjamin H. Wunsch 2019-03-19
10224219 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker 2019-03-05
10032943 Device layer thin-film transfer to thermally conductive substrate Bing Dang, John U. Knickerbocker, Steven L. Wright 2018-07-24
9947570 Handler bonding and debonding for semiconductor dies Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker 2018-04-17
9876200 All-silicon hermetic package and processing for narrow, low-profile microbatteries Paul S. Andry, Bucknell C. Webb 2018-01-23
9833782 Integrated nanofluidic arrays for high capacity colloid separation Joshua T. Smith, Benjamin H. Wunsch 2017-12-05
9700891 Integrated nanofluidic arrays for high capacity colloid separation Joshua T. Smith, Benjamin H. Wunsch 2017-07-11