LH

Li-Wen Hung

IBM: 59 patents #1,342 of 70,183Top 2%
IN Invensense: 5 patents #103 of 391Top 30%
University of California: 1 patents #8,022 of 18,278Top 45%
📍 Mahopac, NY: #11 of 239 inventorsTop 5%
🗺 New York: #1,217 of 115,490 inventorsTop 2%
Overall (All Time): #33,754 of 4,157,543Top 1%
65
Patents All Time

Issued Patents All Time

Showing 51–65 of 65 patents

Patent #TitleCo-InventorsDate
9900677 System for continuous monitoring of body sounds John U. Knickerbocker 2018-02-20
9886640 Method and apparatus to identify a live face image using a thermal radiation sensor and a visual radiation sensor Chia-Yu Chen, Pierce I-Jen Chuang, Jui-Hsin Lai 2018-02-06
9850406 Adhesive resins for wafer bonding Robert David Allen, Jeffrey D. Gelorme, Ratnam Sooriyakumaran, Linda Karin Sundberg 2017-12-26
9818054 Tag with tunable retro-reflectors Evan G. Colgan, Fuad E. Doany, Reinaldo Vega, Bucknell C. Webb 2017-11-14
9748131 Low temperature adhesive resins for wafer bonding Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia K. Tsang 2017-08-29
9735077 Heterogeneous miniaturization platform Qianwen Chen, Wanki Kim, John U. Knickerbocker, Kenneth P. Rodbell, Robert L. Wisnieff 2017-08-15
9653441 Monolithic integration of a III-V optoelectronic device, a filter and a driving circuit Chia-Yu Chen, Jui-Hsin Lai, Ko-Tao Lee 2017-05-16
9617141 MEMS device and process for RF and low resistance applications Michael Julian Daneman, Martin Lim, Xiang Li 2017-04-11
9601364 Low temperature adhesive resins for wafer bonding Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia K. Tsang 2017-03-21
9515216 Light sensitive switch for semiconductor package tamper detection Qing Cao, Shu-Jen Han 2016-12-06
9496230 Light sensitive switch for semiconductor package tamper detection Qing Cao, Shu-Jen Han 2016-11-15
9324601 Low temperature adhesive resins for wafer bonding Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia K. Tsang 2016-04-26
9114977 MEMS device and process for RF and low resistance applications Michael Julian Daneman, Martin Lim, Xiang Li 2015-08-25
9035428 Integrated structure with bidirectional vertical actuation Michael Julian Daneman, Martin Lim, Stephen Lloyd 2015-05-19
8704316 Etchant-free methods of producing a gap between two layers, and devices produced thereby Clark T.-C. Nguyen 2014-04-22