Issued Patents All Time
Showing 26–50 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10546836 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Bing Dang, John U. Knickerbocker, Jae-Woong Nah | 2020-01-28 |
| 10522251 | Infrared detectors and thermal tags for real-time activity monitoring | Jui-Hsin Lai | 2019-12-31 |
| 10508022 | MEMS device and process for RF and low resistance applications | Michael Julian Daneman, Martin Lim, Xiang Li | 2019-12-17 |
| 10505160 | Micro-battery using glass package | Bing Dang, Qianwen Chen, Yang Liu | 2019-12-10 |
| 10490525 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Bing Dang, Russell A. Budd, Bo Wen, Jae-Woong Nah +1 more | 2019-11-26 |
| 10483215 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Jeffrey D. Gelorme, John U. Knickerbocker | 2019-11-19 |
| 10395929 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker | 2019-08-27 |
| 10376186 | Thermal tags for real-time activity monitoring and methods for fabricating the same | Jui-Hsin Lai | 2019-08-13 |
| 10380284 | Heterogeneous miniaturization platform | Qianwen Chen, Wanki Kim, John U. Knickerbocker, Kenneth P. Rodbell, Robert L. Wisnieff | 2019-08-13 |
| 10381255 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Russell A. Budd, Bing Dang, John U. Knickerbocker, Cornelia K. Tsang | 2019-08-13 |
| 10325785 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia Tsang Yang | 2019-06-18 |
| 10311273 | Thermal tags for real-time activity monitoring and methods for detecting the same | Jui-Hsin Lai | 2019-06-04 |
| 10282646 | Tag with tunable retro-reflectors | Evan G. Colgan, Fuad E. Doany, Reinaldo Vega, Bucknell C. Webb | 2019-05-07 |
| 10276439 | Rapid oxide etch for manufacturing through dielectric via structures | Sebastian U. Engelmann, Eric A. Joseph, Eugene J. O'Sullivan, Jeff Waksman, Cornelia Tsang Yang | 2019-04-30 |
| 10251057 | Authentication for device connection using visible patterns | Chia-Yu Chen, Jui-Hsin Lai, Ko-Tao Lee | 2019-04-02 |
| 10250963 | System for continuous monitoring of body sounds | John U. Knickerbocker | 2019-04-02 |
| 10224229 | Double layer release temporary bond and debond processes and systems | Paul S. Andry, Russell A. Budd, Bing Dang, John U. Knickerbocker, Cornelia K. Tsang | 2019-03-05 |
| 10224219 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia Tsang Yang | 2019-03-05 |
| 10217637 | Chip handling and electronic component integration | Russell A. Budd, Qianwen Chen, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker | 2019-02-26 |
| 10174229 | Adhesive resins for wafer bonding | Robert David Allen, Jeffrey D. Gelorme, Ratnam Sooriyakumaran, Linda Karin Sundberg | 2019-01-08 |
| 10168427 | Data readout via reflected ultrasound signals | Reinaldo Vega | 2019-01-01 |
| 10160635 | MEMS device and process for RF and low resistance applications | Michael Julian Daneman, Martin Lim, Xiang Li | 2018-12-25 |
| 10050167 | Light sensitive switch for semiconductor package tamper detection | Qing Cao, Shu-Jen Han | 2018-08-14 |
| 10001561 | Data readout via reflected ultrasound signals | Reinaldo Vega | 2018-06-19 |
| 9947570 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Bing Dang, Jeffrey D. Gelorme, John U. Knickerbocker, Cornelia Tsang Yang | 2018-04-17 |