Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300615 | Infrared debond damage mitigation by copper fill pattern | Mukta G. Farooq, Shahid Butt, Eric D. Perfecto, Michael P. Belyansky, Katsuyuki Sakuma +1 more | 2025-05-13 |
| 12014816 | Multi-sensor platform for health monitoring | John U. Knickerbocker, Bing Dang, Leanna Pancoast | 2024-06-18 |
| 11908723 | Silicon handler with laser-release layers | Akihiro Horibe, Risa Miyazawa, Michael P. Belyansky, John U. Knickerbocker, Takashi Hisada | 2024-02-20 |
| 11876233 | Thin film battery stacking | Bing Dang, John U. Knickerbocker | 2024-01-16 |
| 11710669 | Precision thin electronics handling integration | John U. Knickerbocker, Bing Dang, Joshua M. Rubin, Arvind Kumar | 2023-07-25 |
| 11539080 | Miniaturized electronics package with patterned thin film solid state battery | Bing Dang, John U. Knickerbocker | 2022-12-27 |
| 11539081 | Miniaturized electronics package with patterned thin film solid state battery | Bing Dang, John U. Knickerbocker | 2022-12-27 |
| 11522243 | Hermetic packaging of a micro-battery device | Jae-Woong Nah, Bing Dang, Leanna Pancoast, John U. Knickerbocker | 2022-12-06 |
| 11311224 | Flexible silicon nanowire electrode | Huan Hu, Zheng Xu, Xin Zhang | 2022-04-26 |
| 11222862 | High speed handling of ultra-small chips by selective laser bonding and debonding | Bing Dang, Russell A. Budd, Bo Wen, Li-Wen Hung, Jae-Woong Nah +1 more | 2022-01-11 |
| 11171374 | Thin film solid-state microbattery packaging | Bing Dang, John U. Knickerbocker, Bo Wen | 2021-11-09 |
| 11165248 | Air gap metal tip electrostatic discharge protection | Yang Liu, Dongbing Shao, Zheng Xu | 2021-11-02 |
| 11133670 | Air gap metal tip electrostatic discharge protection | Yang Liu, Dongbing Shao, Zheng Xu | 2021-09-28 |
| 11119504 | Machine learning based airflow sensing for aircraft | Wang-Long Zhou, Huan Hu, Wei Tan | 2021-09-14 |
| 11101513 | Thin film battery packaging | Bing Dang, Bo Wen, Marlon Agno, John U. Knickerbocker | 2021-08-24 |
| 11094407 | Electronics miniaturization platform for medication verification and tracking | John U. Knickerbocker, Li-Wen Hung, Bing Dang, Katsuyuki Sakuma, Jeffrey D. Gelorme +1 more | 2021-08-17 |
| 11058337 | Flexible silicon nanowire electrode | Huan Hu, Zheng Xu, Xin Zhang | 2021-07-13 |
| 11055459 | Heterogeneous miniaturization platform | Li-Wen Hung, Wanki Kim, John U. Knickerbocker, Kenneth P. Rodbell, Robert L. Wisnieff | 2021-07-06 |
| 10964925 | Hermetial via seal for thin film battery | Bing Dang, Yu Luo, John U. Knickerbocker, Jae-Woong Nah, Kai Liu +4 more | 2021-03-30 |
| 10833296 | Thin film solid-state microbattery packaging | Bing Dang, John U. Knickerbocker, Bo Wen | 2020-11-10 |
| 10784380 | Gate-all-around transistor based non-volatile memory devices | Zheng Xu, Zhenxing Bi, Dexin Kong | 2020-09-22 |
| 10687425 | Method of forming a plurality of electro-optical module assemblies | Paul S. Andry, Bing Dang, John U. Knickerbocker, Minhua Lu, Robert J. Polastre +1 more | 2020-06-16 |
| D886684 | T bar chain | — | 2020-06-09 |
| 10670656 | Integrated electro-optical module assembly | Paul S. Andry, Bing Dang, John U. Knickerbocker, Minhua Lu, Robert J. Polastre +1 more | 2020-06-02 |
| 10658973 | Reconfigurable allocation of VNCAP inter-layer vias for co-tuning of L and C in LC tank | Zheng Xu, Hung H. Tran, Ruqiang Bao | 2020-05-19 |