Issued Patents All Time
Showing 25 most recent of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327730 | Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic | Fee Li Lie, Robert C. Wong, Yongan Xu | 2025-06-10 |
| 12293253 | Multipole filter on a quantum device with multiplexing and signal separation | Srikanth Srinivasan, John Blair, George A. Keefe, Thomas George McConkey, Firat Solgun | 2025-05-06 |
| 12107065 | Uniform chip gaps via injection-molded solder pillars | Eric P. Lewandowski, Jae-Woong Nah | 2024-10-01 |
| 12039402 | Color-map method to eliminate qubit frequency crowding in a quantum computing chip | Jared Barney Hertzberg, Alan E. Rosenbluth | 2024-07-16 |
| 11978639 | Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic | Fee Li Lie, Robert C. Wong, Yongan Xu | 2024-05-07 |
| 11894303 | Circuit wiring techniques for stacked transistor structures | Chen Zhang, Zheng Xu, Tenko Yamashita | 2024-02-06 |
| 11749529 | Self-aligned double patterning with spacer-merge region | Rasit Onur Topaloglu, Kafai Lai, Zheng Xu | 2023-09-05 |
| 11699591 | Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic | Fee Li Lie, Robert C. Wong, Yongan Xu | 2023-07-11 |
| 11574103 | Addressing layout retargeting shortfalls | Rasit Onur Topaloglu, Geng Han, Yuping Cui | 2023-02-07 |
| 11568296 | Highway jumper to enable long range connectivity for superconducting quantum computer chip | Markus Brink, Martin O. Sandberg, Vivekananda P. Adiga | 2023-01-31 |
| 11538854 | Coupled-line bus to suppress classical crosstalk for superconducting qubits | Firat Solgun, Markus Brink | 2022-12-27 |
| 11527697 | Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices | Markus Brink, Firat Solgun, Jared Barney Hertzberg | 2022-12-13 |
| 11302532 | Self-aligned double patterning with spacer-merge region | Rasit Onur Topaloglu, Kafai Lai, Zheng Xu | 2022-04-12 |
| 11205035 | Bump connection placement in quantum devices in a flip chip configuration | Markus Brink | 2021-12-21 |
| 11195982 | Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices | Markus Brink, Firat Solgun, Jared Barney Hertzberg | 2021-12-07 |
| 11195799 | Hybrid readout package for quantum multichip bonding | Eric P. Lewandowski, Nicholas Torleiv Bronn, Markus Brink | 2021-12-07 |
| 11189566 | Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias | Lawrence A. Clevenger, Shyng-Tsong Chen, Hao Tang, Jing Sha | 2021-11-30 |
| 11165248 | Air gap metal tip electrostatic discharge protection | Qianwen Chen, Yang Liu, Zheng Xu | 2021-11-02 |
| 11163932 | Semiconductor process modeling to enable skip via in place and route flow | Zheng Xu, Lawrence A. Clevenger | 2021-11-02 |
| 11133670 | Air gap metal tip electrostatic discharge protection | Qianwen Chen, Yang Liu, Zheng Xu | 2021-09-28 |
| 11062911 | Two-color self-aligned double patterning (SADP) to yield static random access memory (SRAM) and dense logic | Fee Li Lie, Robert C. Wong, Yongan Xu | 2021-07-13 |
| 11038093 | Wirebond cross-talk reduction for quantum computing chips | Markus Brink | 2021-06-15 |
| 11036126 | Semiconductor fabrication design rule loophole checking for design for manufacturability optimization | Chieh-Yu Lin, Kehan Tian, Zheng Xu | 2021-06-15 |
| 10950545 | Circuit wiring techniques for stacked transistor structures | Chen Zhang, Zheng Xu, Tenko Yamashita | 2021-03-16 |
| 10936782 | Semiconductor process modeling to enable skip via in place and route flow | Zheng Xu, Lawrence A. Clevenger | 2021-03-02 |