Issued Patents All Time
Showing 51–73 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9822002 | Flexible electronics for wearable healthcare sensors | Paul S. Andry, Huan Hu | 2017-11-21 |
| 9679875 | Reduced volume interconnect for three-dimensional chip stack | Peter A. Gruber, Da-Yuan Shih | 2017-06-13 |
| 9670061 | Flexible electronics for wearable healthcare sensors | Huan Hu, Ning Li, Xiao Hu Liu | 2017-06-06 |
| 9633925 | Visualization of alignment marks on a chip covered by a pre-applied underfill | Mukta G. Farooq, Jae-Woong Nah | 2017-04-25 |
| 9607973 | Method for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Eric D. Perfecto | 2017-03-28 |
| 9543273 | Reduced volume interconnect for three-dimensional chip stack | Peter A. Gruber, Da-Yuan Shih | 2017-01-10 |
| 9431366 | Selective area heating for 3D chip stack | Mario J. Interrante | 2016-08-30 |
| 9385039 | Formation of through-silicon via (TSV) in silicon substrate | — | 2016-07-05 |
| 9373590 | Integrated circuit bonding with interposer die | Mario J. Interrante | 2016-06-21 |
| 9330946 | Method and structure of die stacking using pre-applied underfill | Mukta G. Farooq, Michael A. Gaynes | 2016-05-03 |
| 9263378 | Ball grid array and land grid array assemblies fabricated using temporary resist | Jae-Woong Nah, Charles L. Reynolds | 2016-02-16 |
| 9224712 | 3D bond and assembly process for severely bowed interposer die | Marcus E. Interrante, Mario J. Interrante | 2015-12-29 |
| 9105629 | Selective area heating for 3D chip stack | Mario J. Interrante | 2015-08-11 |
| 9059241 | 3D assembly for interposer bow | Mario J. Interrante | 2015-06-16 |
| 8987131 | Formation of through-silicon via (TSV) in silicon substrate | — | 2015-03-24 |
| 8978960 | Flip chip assembly apparatus employing a warpage-suppressor assembly | Peter J. Brofman, Jae-Woong Nah | 2015-03-17 |
| 8870051 | Flip chip assembly apparatus employing a warpage-suppressor assembly | Peter J. Brofman, Jae-Woong Nah | 2014-10-28 |
| 8759961 | Underfill material dispensing for stacked semiconductor chips | Jae-Woong Nah, Bucknell C. Webb | 2014-06-24 |
| 8759963 | Underfill material dispensing for stacked semiconductor chips | Jae-Woong Nah, Bucknell C. Webb | 2014-06-24 |
| 8523632 | Blasting method and apparatus having abrasive recovery system, processing method of thin-film solar cell panel, and thin-film solar cell panel processed by the method | Keiji Mase, Shigeru Fujinori | 2013-09-03 |
| 7514290 | Chip-to-wafer integration technology for three-dimensional chip stacking | Paul S. Andry, Kuniaki Sueoka, John U. Knickerbocker | 2009-04-07 |
| 7088324 | Liquid crystal display driver and method thereof | Yoshitami Sakaguchi | 2006-08-08 |
| 6937233 | Liquid crystal display | Yoshitami Sakaguchi | 2005-08-30 |