Issued Patents All Time
Showing 51–75 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6911391 | Integration of titanium and titanium nitride layers | Michael Yang, Toshio Itoh | 2005-06-28 |
| 6866746 | Clamshell and small volume chamber with fixed substrate support | Lawrence Chung-Lai Lei, Alfred Mak, Gwo-Chuan Tzu, Avi Tepman, Walter Glenn | 2005-03-15 |
| 6846516 | Multiple precursor cyclical deposition system | Michael Yang, Hyungsuk Alexander Yoon, Hui Zhang, Hongbin Fang | 2005-01-25 |
| 6809026 | Selective deposition of a barrier layer on a metal film | Hyungsuk Alexander Yoon, Michael Yang, Hui Zhang, Soonil Hong | 2004-10-26 |
| 6797340 | Method for depositing refractory metal layers employing sequential deposition techniques | Hongbin Fang, Hyung-Suk Yoon, Ken Kaung Lai, Chi C. Young, James Horng +2 more | 2004-09-28 |
| 6734020 | Valve control system for atomic layer deposition chamber | Siqing Lu, Yu-Chia Chang, Dongxi Sun, Vinh Dang, Michael Yang +2 more | 2004-05-11 |
| 6720027 | Cyclical deposition of a variable content titanium silicon nitride layer | Michael Yang | 2004-04-13 |
| 6660126 | Lid assembly for a processing system to facilitate sequential deposition techniques | Anh N. Nguyen, Michael Yang, Hua Chung, Anzhong Chang, Xiaoxiong Yuan +1 more | 2003-12-09 |
| 6624064 | Chamber seasoning method to improve adhesion of F-containing dielectric film to metal for VLSI application | Turgut Sahin, Yaxin Wang | 2003-09-23 |
| 6555183 | Plasma treatment of a titanium nitride film formed by chemical vapor deposition | Shulin Wang, Zvi Lando, Mei Chang | 2003-04-29 |
| 6551929 | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques | Moris Kori, Alfred Mak, Jeong Soo Byun, Lawrence Chung-Lai Lei, Hua Chung +1 more | 2003-04-22 |
| 6548402 | Method of depositing a thick titanium nitride film | Shulin Wang, Frederick Wu, Ramanujapuram A. Srinivas, Yehuda Demayo, Zvi Lando +2 more | 2003-04-15 |
| 6436820 | Method for the CVD deposition of a low residual halogen content multi-layered titanium nitride film having a combined thickness greater than 1000 å | Jianhua Hu, Yin Lin, Fufa Chen, Yehuda Demayo | 2002-08-20 |
| 6365495 | Method for performing metallo-organic chemical vapor deposition of titanium nitride at reduced temperature | Shulin Wang, Huan Luo, Keith Kuang-Kuo Koai, Mei Chang, Russell C. Ellwanger | 2002-04-02 |
| 6326690 | Method of titanium/titanium nitride integration | Shulin Wang, Zvi Lando, Mei Chang | 2001-12-04 |
| 6323119 | CVD deposition method to improve adhesion of F-containing dielectric metal lines for VLSI application | Turgut Sahin, Yaxin Wang | 2001-11-27 |
| 6299692 | Head for vaporizing and flowing various precursor materials onto semiconductor wafers during chemical vapor deposition | Vincent Ku, Xiaoxiong Yuan, Anzhong Chang, Anh N. Nguyen | 2001-10-09 |
| 6221174 | Method of performing titanium/titanium nitride integration | Fufa Chen, Yin Lin, Jianhua Hu, Frederick Wu, Li Wu | 2001-04-24 |
| 6218301 | Deposition of tungsten films from W(CO)6 | Hyungsuk Alexander Yoon, Michael Yang | 2001-04-17 |
| 6214714 | Method of titanium/titanium nitride integration | Shulin Wang, Zvi Lando, Mei Chang | 2001-04-10 |
| 6211065 | Method of depositing and amorphous fluorocarbon film using HDP-CVD | Eugene Tzou, LIE CHENG, Turgut Sahin, Yaxin Wang | 2001-04-03 |
| 6066836 | High temperature resistive heater for a process chamber | Steven Chen, Henry Ho, Mei Chang, Chen-An Chen, Chiliang Chen | 2000-05-23 |
| 5926743 | Process for chlorine trifluoride chamber cleaning | Kazuhiro Nishina, Steve Chen, Toshiaki Fujita | 1999-07-20 |
| 5849092 | Process for chlorine trifluoride chamber cleaning | Kazuhiro Nishina, Steve Chen, Toshiaki Fujita | 1998-12-15 |
| 5837058 | High temperature susceptor | Steven Chen, Ruiping Wang | 1998-11-17 |