Issued Patents All Time
Showing 26–50 of 103 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790323 | Self ionized sputtering using a high density plasma source | Jianming Fu, Praburam Gopalraja, John E. Foster | 2004-09-14 |
| 6787006 | Operating a magnetron sputter reactor in two modes | Praburam Gopalraja, Jianming Fu, Girish Dixit, Zheng Xu, Wei Wang +1 more | 2004-09-07 |
| 6784096 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Ling Chen, Walter Glenn, Praburam Gopalraja, Jianming Fu | 2004-08-31 |
| 6758947 | Damage-free sculptured coating deposition | Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more | 2004-07-06 |
| 6743714 | Low temperature integrated metallization process and apparatus | Roderick C. Mosely, Hong Mei Zhang, Ted Guo, Liang-Yuh Chen | 2004-06-01 |
| 6726776 | Low temperature integrated metallization process and apparatus | Roderick C. Mosely, Hong Mei Zhang, Ted Guo | 2004-04-27 |
| 6679981 | Inductive plasma loop enhancing magnetron sputtering | Shaoher X. Pan, Hiroji Hanawa, John C. Forster | 2004-01-20 |
| 6617242 | Method for fabricating interlevel contacts of aluminum/refractory metal alloys | Fu-Tai Liou, Timothy E. Turner, Che-Chia Wei, Yih-Shung Lin, Girish Dixit | 2003-09-09 |
| 6610189 | Method and associated apparatus to mechanically enhance the deposition of a metal film within a feature | Hougong Wang, Bo Zheng, Girish Dixit | 2003-08-26 |
| 6566258 | Bi-layer etch stop for inter-level via | Girish Dixit | 2003-05-20 |
| 6537905 | Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug | Liang-Yuh Chen, Ted Guo, Roderick Craig Mosley | 2003-03-25 |
| 6514390 | Method to eliminate coil sputtering in an ICP source | Zheng Xu, Jaim Nulman | 2003-02-04 |
| 6485618 | Integrated copper fill process | Praburam Gopalraja, Jianming Fu, Girish Dixit, Zheng Xu, Sankaram Athreya +2 more | 2002-11-26 |
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes | Praburam Gopalraja, Jianming Fu, Girish Dixit, Zheng Xu, Wei Wang +1 more | 2002-09-17 |
| 6399479 | Processes to improve electroplating fill | Zheng Xu, Peijun Ding, Barry Chin, Ashok Sinha | 2002-06-04 |
| 6383915 | Tailoring of a wetting/barrier layer to reduce electromigration in an aluminum interconnect | Jingang Su, Gongda Yao, Zhang Xu | 2002-05-07 |
| 6355560 | Low temperature integrated metallization process and apparatus | Roderick C. Mosely, Hong Mei Zhang, Ted Guo | 2002-03-12 |
| 6306265 | High-density plasma for ionized metal deposition capable of exciting a plasma wave | Jianming Fu, Praburam Gopalraja, John C. Forster | 2001-10-23 |
| 6303452 | Method for making transistor spacer etch pinpoint structure | Frank R. Bryant, Girish Dixit | 2001-10-16 |
| 6287963 | Method for forming a metal contact | Fu-Tai Liou, Girish Dixit, Che-Chia Wei | 2001-09-11 |
| 6277249 | Integrated process for copper via filling using a magnetron and target producing highly energetic ions | Praburam Gopalraja, Jianming Fu, Girish Dixit, Zheng Xu, Sankaram Athreya +2 more | 2001-08-21 |
| 6274008 | Integrated process for copper via filling | Praburam Gopalraja, Jianming Fu, Girish Dixit, Zheng Xu, Sankaram Athreya +2 more | 2001-08-14 |
| 6271137 | Method of producing an aluminum stacked contact/via for multilayer | Fu-Tai Liou | 2001-08-07 |
| 6242811 | Interlevel contact including aluminum-refractory metal alloy formed during aluminum deposition at an elevated temperature | Fu-Tai Liou, Timothy E. Turner, Che-Chia Wei, Yih-Shung Lin, Girish Dixit | 2001-06-05 |
| 6238803 | Titanium nitride barrier layers | Jianming Fu, Zheng Xu | 2001-05-29 |