Issued Patents All Time
Showing 51–75 of 103 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6238528 | Plasma density modulator for improved plasma density uniformity and thickness uniformity in an ionized metal plasma source | Zheng Xu, Jianming Fu | 2001-05-29 |
| 6217721 | Filling narrow apertures and forming interconnects with a metal utilizing a crystallographically oriented liner layer | Zheng Xu, John C. Forster, Tse-Yong Yao, Jaim Nulman | 2001-04-17 |
| 6139697 | Low temperature integrated via and trench fill process and apparatus | Liang-Yuh Chen, Roderick C. Mosely, Rong Tao, Ted Guo | 2000-10-31 |
| 6120844 | Deposition film orientation and reflectivity improvement using a self-aligning ultra-thin layer | Liang-Yuh Chen, Ted Guo, Roderick C. Mosely | 2000-09-19 |
| 6110821 | Method for forming titanium silicide in situ | Gene Y. Kohara, Hyman J. Levinstein, Zheng Xu, Peijun Ding, Gongda Yao +1 more | 2000-08-29 |
| 6066358 | Blanket-selective chemical vapor deposition using an ultra-thin nucleation layer | Ted Guo, Liang-Yuh Chen, Roderick C. Mosely | 2000-05-23 |
| 6007684 | Process for forming improved titanium-containing barrier layers | Jianming Fu | 1999-12-28 |
| 5977607 | Method of forming isolated regions of oxide | Robert Louis Hodges, Frank R. Bryant, Che-Chia Wei | 1999-11-02 |
| 5930673 | Method for forming a metal contact | Fu-Tai Liou, Yih-Shung Lin, Girish Dixit, Che-Chia Wei | 1999-07-27 |
| 5903428 | Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating same | Dennis S. Grimard, Vijay D. Parkhe, Hyman J. Levinstein, Michael G. Chafin | 1999-05-11 |
| 5895266 | Titanium nitride barrier layers | Jianming Fu, Zheng Xu | 1999-04-20 |
| 5877087 | Low temperature integrated metallization process and apparatus | Roderick C. Mosely, Hong Mei Zhang, Ted Guo | 1999-03-02 |
| 5858184 | Process for forming improved titanium-containing barrier layers | Jianming Fu | 1999-01-12 |
| 5856233 | Method of forming a field programmable device | Frank R. Bryant, Girish Dixit | 1999-01-05 |
| 5851344 | Ultrasonic wave assisted contact hole filling | Zheng Xu | 1998-12-22 |
| 5847457 | Structure and method of forming vias | Fu-Tai Liou, Girish Dixit | 1998-12-08 |
| 5841624 | Cover layer for a substrate support chuck and method of fabricating same | Zheng Xu, Jianming Fu | 1998-11-24 |
| 5759869 | Method to imporve metal step coverage by contact reflow | Frank R. Bryant, Girish Dixit | 1998-06-02 |
| 5610103 | Ultrasonic wave assisted contact hole filling | Zheng Xu | 1997-03-11 |
| 5593921 | Method of forming vias | Fu-Tai Liou, Girish Dixit | 1997-01-14 |
| 5582971 | Method of forming submicron contacts | Robert O. Miller, Girish Dixit | 1996-12-10 |
| 5578872 | Planar contact with a void | Girish Dixit, Robert O. Miller | 1996-11-26 |
| 5571752 | Method of forming a planar contact with a void | Girish Dixit, Robert O. Miller | 1996-11-05 |
| 5523624 | Integrated circuit device structure with dielectric and metal stacked plug in contact hole | Robert O. Miller, Girish Dixit | 1996-06-04 |
| 5521411 | Transistor spacer etch pinpoint structure | Frank R. Bryant, Girish Dixit | 1996-05-28 |