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Method for controlling a plasma process |
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2022-09-20 |
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Radio frequency filter system for a processing chamber |
Andrew Nguyen, Lu Liu, Anilkumar Rayaroth |
2020-11-17 |
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Method, apparatus and system for wafer dechucking using dynamic voltage sweeping |
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| 9601301 |
Non-intrusive measurement of a wafer DC self-bias in semiconductor processing equipment |
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2017-03-21 |
| 9070536 |
Plasma reactor electrostatic chuck with cooled process ring and heated workpiece support surface |
Michael D. Willwerth, David Palagashvili, Ying-Sheng Lin |
2015-06-30 |
| 8580693 |
Temperature enhanced electrostatic chucking in plasma processing apparatus |
Sergey G. Belostotskiy, Jingbao Liu, David Palagashvili |
2013-11-12 |
| 8270141 |
Electrostatic chuck with reduced arcing |
Michael D. Willwerth, David Palagashvili, Douglas A. Buchberger, Jr. |
2012-09-18 |
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Plasma control using dual cathode frequency mixing |
Steven C. Shannon, Dennis S. Grimard, Theodoros Panagopoulos, Daniel J. Hoffman, Troy S. Detrick +4 more |
2010-11-23 |
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Time-based wafer de-chucking from an electrostatic chuck having separate RF BIAS and DC chucking electrodes |
Steven C. Shannon, Dennis S. Grimard |
2010-10-12 |
| 6824748 |
Heated catalytic treatment of an effluent gas from a substrate fabrication process |
Tony Kaushal, Shamouil Shamouilian, Harshad Borgaonkar, Kwok Manus Wong, Ashish Bhatnagar |
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| 6273958 |
Substrate support for plasma processing |
Shamouil Shamouilian, Ananda H. Kumar, Siamak Salimian, Mahmoud Dahimene, Dennis S. Grimard |
2001-08-14 |
| 6151203 |
Connectors for an electrostatic chuck and combination thereof |
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2000-11-21 |
| 6095084 |
High density plasma process chamber |
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2000-08-01 |
| 5903428 |
Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating same |
Dennis S. Grimard, Vijay D. Parkhe, Hyman J. Levinstein, Fusen Chen |
1999-05-11 |
| 5636098 |
Barrier seal for electrostatic chuck |
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1997-06-03 |