| 12253190 |
Non-elastomeric, non-polymeric, non-metallic membrane valves for semiconductor processing equipment |
Mariusch Gregor, Thorsten Lill |
2025-03-18 |
| 11796085 |
Non-elastomeric, non-polymeric, non-metallic membrane valves for semiconductor processing equipment |
Mariusch Gregor, Thorsten Lill |
2023-10-24 |
| 11380556 |
Thermal atomic layer etch with rapid temperature cycling |
Andreas Fischer, Thorsten Lill |
2022-07-05 |
| 10257887 |
Substrate support assembly |
Alexander Matyushkin, Dan Katz, John Holland, Michael D. Willwerth |
2019-04-09 |
| 10153282 |
Ultra-high vacuum transport and storage |
Richard H. Gould, Edmundo Reyes, John D. Boniface, Ivan L. Berry, III, Alexander Dulkin +1 more |
2018-12-11 |
| 9883549 |
Substrate support assembly having rapid temperature control |
Alexander Matyushkin, Dan Katz, John Holland, Michael D. Willwerth |
2018-01-30 |
| 9275887 |
Substrate processing with rapid temperature gradient control |
Alexander Matyushkin, Dan Katz, John Holland, Michael D. Willwerth |
2016-03-01 |
| 8663391 |
Electrostatic chuck having a plurality of heater coils |
Alexander Matyushkin, Dennis Koosau, John Holland |
2014-03-04 |
| 8236133 |
Plasma reactor with center-fed multiple zone gas distribution for improved uniformity of critical dimension bias |
Dan Katz, David Palagashvili, Brian K. Hatcher, Valentin N. Todorow, Edward P. Hammond, IV +2 more |
2012-08-07 |
| 8226769 |
Substrate support with electrostatic chuck having dual temperature zones |
Alexander Matyushkin, Dennis Koosau, John Holland |
2012-07-24 |
| 8075729 |
Method and apparatus for controlling temperature of a substrate |
John Holland |
2011-12-13 |
| 7838430 |
Plasma control using dual cathode frequency mixing |
Steven C. Shannon, Dennis S. Grimard, Daniel J. Hoffman, Michael G. Chafin, Troy S. Detrick +4 more |
2010-11-23 |
| 7780864 |
Process using combined capacitively and inductively coupled plasma sources for controlling plasma ion radial distribution |
Alexander Paterson, Valentin N. Todorow, Brian K. Hatcher, Dan Katz, Edward P. Hammond, IV +2 more |
2010-08-24 |
| 7727413 |
Dual plasma source process using a variable frequency capacitively coupled source to control plasma ion density |
Alexander Paterson, Valentin N. Todorow, Brian K. Hatcher, Dan Katz, Edward P. Hammond, IV +2 more |
2010-06-01 |
| 7674394 |
Plasma process for inductively coupling power through a gas distribution plate while adjusting plasma distribution |
Alexander Paterson, Valentin Todorov, Brian K. Hatcher, Dan Katz, Edward P. Hammond, IV +1 more |
2010-03-09 |
| 7648914 |
Method for etching having a controlled distribution of process results |
Thomas J. Kropewnicki, Nicolas Gani, Wilfred Pau, Meihua Shen, John Holland |
2010-01-19 |
| 7645357 |
Plasma reactor apparatus with a VHF capacitively coupled plasma source of variable frequency |
Alexander Paterson, Valentin N. Todorow, Brian K. Hatcher, Dan Katz, Edward P. Hammond, IV +2 more |
2010-01-12 |
| 7544251 |
Method and apparatus for controlling temperature of a substrate |
John Holland |
2009-06-09 |
| 7510665 |
Plasma generation and control using dual frequency RF signals |
Steven C. Shannon, Alexander Paterson, John Holland, Dennis S. Grimard, Daniel J. Hoffman |
2009-03-31 |
| 7436645 |
Method and apparatus for controlling temperature of a substrate |
John Holland, Alexander Matyushkin, Dan Katz, Michael F. Hegarty, Denis M. Koosau +1 more |
2008-10-14 |
| 7431857 |
Plasma generation and control using a dual frequency RF source |
Steven C. Shannon, Alex Paterson, John Holland, Dennis S. Grimard, Yashushi Takakura |
2008-10-07 |
| 7264688 |
Plasma reactor apparatus with independent capacitive and toroidal plasma sources |
Alexander Paterson, Valentin N. Todorow, Brian K. Hatcher, Dan Katz, Edward P. Hammond, IV +2 more |
2007-09-04 |
| 6905968 |
Process for selectively etching dielectric layers |
Chang-Lin Hsieh, Jie Yuan, Hui Chen, Yan Ye |
2005-06-14 |
