Issued Patents All Time
Showing 51–75 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6387805 | Copper alloy seed layer for copper metallization | Peijun Ding, Tony P. Chiang, Imran Hashim, Bingxi Sun | 2002-05-14 |
| 6352926 | Structure for improving low temperature copper reflow in semiconductor features | Peijun Ding, Imran Hashim | 2002-03-05 |
| 6328871 | Barrier layer for electroplating processes | Peijun Ding, Tony P. Chiang, Tse-Yong Yao | 2001-12-11 |
| 6313033 | Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode applications | Tony P. Chiang, Bingxi Sun, Suraj Rengarajan, Peijun Ding | 2001-11-06 |
| 6287977 | Method and apparatus for forming improved metal interconnects | Imran Hashim, Tony P. Chiang | 2001-09-11 |
| 6235163 | Methods and apparatus for ionized metal plasma copper deposition with enhanced in-film particle performance | Darryl Angelo, Arvind Sundarrajan, Peijun Ding, James Tsung, Ilyoung Richard Hong | 2001-05-22 |
| 6200433 | IMP technology with heavy gas sputtering | Peijun Ding, Rong Tao, Dan Carl | 2001-03-13 |
| 6184137 | Structure and method for improving low temperature copper reflow in semiconductor features | Peijun Ding, Imran Hashim | 2001-02-06 |
| 6174811 | Integrated deposition process for copper metallization | Peijun Ding, Imran Hashim, Bingxi Sun | 2001-01-16 |
| 6160315 | Copper alloy via structure | Tony P. Chiang, Peijun Ding, Imran Hashim, Bingxi Sun | 2000-12-12 |
| 6152074 | Deposition of a thin film on a substrate using a multi-beam source | Marc Schweitzer, Ivo Raaijmakers | 2000-11-28 |
| 6139699 | Sputtering methods for depositing stress tunable tantalum and tantalum nitride films | Tony P. Chiang, Peijun Ding | 2000-10-31 |
| 6140235 | High pressure copper fill at low temperature | Tse-Yong Yao | 2000-10-31 |
| 6066892 | Copper alloy seed layer for copper metallization in an integrated circuit | Peijun Ding, Tony P. Chiang, Imran Hashim, Bingxi Sun | 2000-05-23 |
| 6037257 | Sputter deposition and annealing of copper alloy metallization | Tony P. Chiang, Peijun Ding, Imran Hashim, Bingxi Sun | 2000-03-14 |
| 5925411 | Gas-based substrate deposition protection | Everhardus P. van de Ven, Eliot K. Broadbent, Jeffrey C. Benzing, Christopher W. Burkhart | 1999-07-20 |
| 5882417 | Apparatus for preventing deposition on frontside peripheral region and edge of wafer in chemical vapor deposition apparatus | Everhardus P. van de Ven, Eliot K. Broadbent, Jeffrey C. Benzing, Christopher W. Burkhart, Lawrence C. Lane +1 more | 1999-03-16 |
| 5843233 | Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus | Everhardus P. van de Ven, Eliot K. Broadbent, Jeffrey C. Benzing, Christopher W. Burkhart, Lawrence C. Lane +1 more | 1998-12-01 |
| 5769951 | Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus | Everhardus P. van de Ven, Eliot K. Broadbent, Jeffrey C. Benzing, Christopher W. Burkhart, Lawrence C. Lane | 1998-06-23 |
| 5620525 | Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate | Everhardus P. van de Ven, Eliot K. Broadbent, Jeffrey C. Benzing, Christopher W. Burkhart | 1997-04-15 |
| 5578532 | Wafer surface protection in a gas deposition process | Everhardus P. van de Ven, Eliot K. Broadbent, Jeffrey C. Benzing, Christopher W. Burkhart | 1996-11-26 |
| 5374594 | Gas-based backside protection during substrate processing | Everhardus P. van de Ven, Eliot K. Broadbent, Jeffrey C. Benzing, Christopher W. Burkhart | 1994-12-20 |
| 5238499 | Gas-based substrate protection during processing | Everhardus P. van de Ven, Eliot K. Broadbent, Jeffrey C. Benzing, Christopher W. Burkhart | 1993-08-24 |
| 5230741 | Gas-based backside protection during substrate processing | Everhardus P. van de Ven, Eliot K. Broadbent, Jeffrey C. Benzing, Christopher W. Burkhart | 1993-07-27 |
| 4759836 | Ion implantation of thin film CrSi.sub.2 and SiC resistors | Lorimer K. Hill, Richard A. Blanchard | 1988-07-26 |