Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Hoa Kieu — 11 Patents

Applied Materials: 11 patents #1,208 of 7,310Top 20%
Sunnyvale, CA: #2,552 of 14,302 inventorsTop 20%
California: #56,011 of 386,348 inventorsTop 15%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Hoa Kieu has been granted 11 US patents while listed as an inventor at Applied Materials. The first was granted in 1992 and the most recent in May 2006. Hoa Kieu ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Hoa Kieu in Sunnyvale, CA, US.

Patents per Year

Patents granted per year, 1992 to 2006Bar chart with a peak of 2 patents in 1998.peak 21992: 1 patents19921997: 1 patents19971998: 2 patents19981999: 1 patents19992000: 1 patents20002001: 2 patents20012004: 1 patents20042005: 1 patents20052006: 1 patents2006

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
7041200 Reducing particle generation during sputter deposition Hien Minh Le, Keith A. Miller, Kenny King-Tai Ngan 2006-05-09 $14,267,000
6946408 Method and apparatus for depositing dielectric films Hien Minh Le 2005-09-20 $22,251,000
6750156 Method and apparatus for forming an anti-reflective coating on a substrate Hien Minh Le 2004-06-15 $39,216,000
6312568 Two-step AIN-PVD for improved film properties Ingo Wilke, Rochelle King 2001-11-06 $45,107,000
6232665 Silicon-doped titanium wetting layer for aluminum plug Gongda Yao, Peijun Ding, Zheng Xu 2001-05-15 $105,754,000
6033541 Deposition process for coating or filling re-entry shaped contact holes Zheng Xu 2000-03-07 $83,205,000
5911113 Silicon-doped titanium wetting layer for aluminum plug Gongda Yao, Peijun Ding, Zheng Xu 1999-06-08 $70,049,000
5847461 Integrated circuit structure having contact openings and vias filled by self-extrusion of overlying metal layer Zheng Xu, Tse-Yong Yao, Julio Aranovich 1998-12-08 $65,812,000
5780357 Deposition process for coating or filling re-entry shaped contact holes Zheng Xu 1998-07-14 $20,241,000
5668055 Method of filling of contact openings and vias by self-extrusion of overlying compressively stressed matal layer Zheng Xu, Tse-Yong Yao, Julio Aranovich 1997-09-16 $105,733,000
5171412 Material deposition method for integrated circuit manufacturing Homoyoun Talieh, Avi Tepman, Chien Rhone Wang 1992-12-15 $18,038,000