Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6110821 | Method for forming titanium silicide in situ | Gene Y. Kohara, Fusen Chen, Hyman J. Levinstein, Zheng Xu, Peijun Ding +1 more | 2000-08-29 |
| 6077402 | Central coil design for ionized metal plasma deposition | Liubo Hong, Hougong Wang, Zheng Xu | 2000-06-20 |
| 6077404 | Reflow chamber and process | Hougong Wang, Steve Lai, Peijun Ding | 2000-06-20 |
| 6045666 | Aluminum hole filling method using ionized metal adhesion layer | Peter Satitpunwaycha, Kenny King-Tai Ngan, Zheng Xu | 2000-04-04 |
| 5985759 | Oxygen enhancement of ion metal plasma (IMP) sputter deposited barrier layers | Edwin Kim, Michael Nam, Chris Cha, Sophia Lee, Fernand Dorleans +2 more | 1999-11-16 |
| 5911113 | Silicon-doped titanium wetting layer for aluminum plug | Peijun Ding, Zheng Xu, Hoa Kieu | 1999-06-08 |