Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7071024 | Method for packaging a microelectronic device using on-die bond pad expansion | Steven Towle, Quat Vu | 2006-07-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7071024 | Method for packaging a microelectronic device using on-die bond pad expansion | Steven Towle, Quat Vu | 2006-07-04 |