| 7189596 |
Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures |
Qing Ma, Quat Vu, Steven Towle |
2007-03-13 |
| 6825063 |
Integrated core microelectronic package |
Quat Vu, Jian Li, Qing Ma, Maria V. Henao |
2004-11-30 |
| 6743664 |
Flip-chip on flex for high performance packaging applications |
Chunlin Liang, Larry E. Mosley |
2004-06-01 |
| 6737754 |
COF packaged semiconductor |
Qing Ma, Jin Lee, Quat Vu, Jian Li, Larry E. Mosley |
2004-05-18 |
| 6271469 |
Direct build-up layer on an encapsulated die package |
Qing Ma, Harry Fujimoto |
2001-08-07 |
| 6238954 |
COF packaged semiconductor |
Qing Ma, Jin Lee, Quat Vu, Jian Li, Larry E. Mosley |
2001-05-29 |
| 6154366 |
Structures and processes for fabricating moisture resistant chip-on-flex packages |
Qing Ma, Harry Fujimoto, John R. CARRUTHERS, Jian Li, Chuanbin Pan |
2000-11-28 |