Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7189596 | Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures | Qing Ma, Quat Vu, Steven Towle | 2007-03-13 | $17,337,000 |
| 6825063 | Integrated core microelectronic package | Quat Vu, Jian Li, Qing Ma, Maria V. Henao | 2004-11-30 | $36,984,000 |
| 6743664 | Flip-chip on flex for high performance packaging applications | Chunlin Liang, Larry E. Mosley | 2004-06-01 | $40,563,000 |
| 6737754 | COF packaged semiconductor | Qing Ma, Jin Lee, Quat Vu, Jian Li, Larry E. Mosley | 2004-05-18 | $30,392,000 |
| 6271469 | Direct build-up layer on an encapsulated die package | Qing Ma, Harry Fujimoto | 2001-08-07 | $139,051,000 |
| 6238954 | COF packaged semiconductor | Qing Ma, Jin Lee, Quat Vu, Jian Li, Larry E. Mosley | 2001-05-29 | $200,835,000 |
| 6154366 | Structures and processes for fabricating moisture resistant chip-on-flex packages | Qing Ma, Harry Fujimoto, John R. CARRUTHERS, Jian Li, Chuanbin Pan | 2000-11-28 | $170,940,000 |