MH

Michael C. Harmes

IN Intel: 5 patents #7,174 of 30,777Top 25%
Overall (All Time): #1,013,259 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8421225 Three-dimensional stacked substrate arrangements Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more 2013-04-16
8203208 Three-dimensional stacked substrate arrangements Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more 2012-06-19
7973407 Three-dimensional stacked substrate arrangements Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more 2011-07-05
7348217 Method and structure for interfacing electronic devices Mauro J. Kobrinsky, R. Scott List, Sarah Kim 2008-03-25
6870270 Method and structure for interfacing electronic devices Mauro J. Kobrinsky, R. Scott List, Sarah Kim 2005-03-22