Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8421225 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more | 2013-04-16 | $28,862,000 |
| 8203208 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more | 2012-06-19 | $20,138,000 |
| 7973407 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Scott List, Michael Chan, Mauro J. Kobrinsky +3 more | 2011-07-05 | $27,745,000 |
| 7348217 | Method and structure for interfacing electronic devices | Mauro J. Kobrinsky, R. Scott List, Sarah Kim | 2008-03-25 | $11,219,000 |
| 6870270 | Method and structure for interfacing electronic devices | Mauro J. Kobrinsky, R. Scott List, Sarah Kim | 2005-03-22 | $25,941,000 |