Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8421225 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Michael Chan, Mauro J. Kobrinsky, Sarah Kim +3 more | 2013-04-16 |
| 8203208 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Michael Chan, Mauro J. Kobrinsky, Sarah Kim +3 more | 2012-06-19 |
| 7973407 | Three-dimensional stacked substrate arrangements | Shriram Ramanathan, Patrick Morrow, Michael Chan, Mauro J. Kobrinsky, Sarah Kim +3 more | 2011-07-05 |
| 7307005 | Wafer bonding with highly compliant plate having filler material enclosed hollow core | Mauro J. Kobrinsky, Shriram Ramanathan | 2007-12-11 |
| 7214605 | Deposition of diffusion barrier | Shriram Ramanathan, Grant Kloster, Patrick Morrow, Vijayakumar Ramachandrarao | 2007-05-08 |