Scot Kellar — 15 Patents at Intel

Scot Kellar has been granted 15 US patents while listed as an inventor at Intel. The first was granted in 2003 and the most recent in March 2025. Scot Kellar ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Scot Kellar in Bend, OR, US.

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12242315	Thermal management in horizontally or vertically stacked dies	Somvir Dahiya, Stephen H. Gunther, Julien Sebot, Randy B. Osborne, Joshua Een	2025-03-04
10068866	Integrated circuit package having rectangular aspect ratio	Darren Crews	2018-09-04	$19,235,000
7271434	Capacitor with insulating nanostructure	Sarah Kim	2007-09-18	$14,997,000
7265406	Capacitor with conducting nanostructure	Sarah Kim	2007-09-04	$18,654,000
7244983	Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode	Sarah Kim	2007-07-17	$13,694,000
7157787	Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices	Sarah Kim, R. Scott List	2007-01-02
7091084	Ultra-high capacitance device based on nanostructures	Sarah Kim	2006-08-15	$13,533,000
7056807	Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack	Sarah Kim, R. Scott List	2006-06-06	$10,284,000
7037804	Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration	Sarah Kim, R. Scott List	2006-05-02	$12,289,000
6975016	Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof	Sarah Kim, R. Scott List	2005-12-13	$11,810,000
6911373	Ultra-high capacitance device based on nanostructures	Sarah Kim	2005-06-28	$36,074,000
6887769	Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same	Sarah Kim, R. Scott List	2005-05-03	$20,343,000
6762076	Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices	Sarah Kim, R. Scott List	2004-07-13	$47,892,000
6661085	Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack	Sarah Kim, R. Scott List	2003-12-09	$40,688,000
6599808	Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode	Sarah Kim	2003-07-29	$49,479,000

Scot Kellar — 15 Patents

Issued Patents All Time

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