| 10367470 |
Wafer-level-packaged BAW devices with surface mount connection structures |
Matthew Wasilik, Buu Q. Diep, Ian Y. K. Yee, Bang Nguyen, Robert Kraft |
2019-07-30 |
$15,263,000 |
| 10090820 |
Stealth-dicing compatible devices and methods to prevent acoustic backside reflections on acoustic wave devices |
Robert Aigner |
2018-10-02 |
$12,078,000 |
| 10070537 |
Formation of dielectric with smooth surface |
Deepak Arora, Daniel N. Sobieski, Dilan Seneviratne, James C. Meyer |
2018-09-04 |
$19,235,000 |
| 9633837 |
Methods of providing dielectric to conductor adhesion in package structures |
Vinodhkumar Raghunathan |
2017-04-25 |
$8,972,000 |
| 9520350 |
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer |
Weng Hong Teh, Emile Davies-Venn, Digvijay A. Raorane, Daniel N. Sobieski |
2016-12-13 |
$15,488,000 |
| 9136221 |
Methods of providing dielectric to conductor adhesion in package structures |
Vinodhkumar Raghunathan |
2015-09-15 |
$17,844,000 |
| 8129767 |
Ferroelectric polymer memory module |
Lee Rockford |
2012-03-06 |
$22,588,000 |
| 7808024 |
Ferroelectric polymer memory module |
Lee Rockford |
2010-10-05 |
$13,644,000 |
| 7800203 |
Method of reducing the surface roughness of spin coated polymer films |
Michael J. Leeson |
2010-09-21 |
$10,255,000 |
| 7755124 |
Laminating magnetic materials in a semiconductor device |
Arnel M. Fajardo, Changmin Park, Patrick Morrow |
2010-07-13 |
$17,820,000 |
| 7727777 |
Forming ferroelectric polymer memories |
Mark Isenberger, Michael J. Leeson, Mani Rahnama |
2010-06-01 |
|
| 7709873 |
Polymer memory with adhesion layer containing an immobilized metal |
Valery M. Dubin |
2010-05-04 |
$15,201,000 |
| 7595203 |
Ferroelectric memory device with a conductive polymer layer and a method of formation |
— |
2009-09-29 |
$24,442,000 |
| 7427559 |
Method of reducing the surface roughness of spin coated polymer films |
Michael J. Leeson |
2008-09-23 |
$21,762,000 |
| 7396692 |
Method for increasing ferroelectric characteristics of polymer memory cells |
Hitesh Windlass, Daniel Diana |
2008-07-08 |
$24,723,000 |
| 7326981 |
Methods and apparatuses for producing a polymer memory device |
Makarem A. Hussein, Peter K. Moon, Daniel Diana |
2008-02-05 |
$13,136,000 |
| 7223613 |
Ferroelectric polymer memory with a thick interface layer |
Mark Richards, Daniel Diana, Hitesh Windlass, Wayne Ford |
2007-05-29 |
$13,871,000 |
| 7196422 |
Low-dielectric constant structure with a multilayer stack of thin films with pores |
— |
2007-03-27 |
$11,700,000 |
| 7184289 |
Parallel electrode memory |
Richard Coulson |
2007-02-27 |
$10,067,000 |
| 7169620 |
Method of reducing the surface roughness of spin coated polymer films |
Michael J. Leeson |
2007-01-30 |
$14,098,000 |
| 7170122 |
Ferroelectric polymer memory with a thick interface layer |
Mark Richards, Daniel Diana, Hitesh Windlass, Wayne Ford |
2007-01-30 |
$14,098,000 |
| 7164166 |
Memory circuit with spacers between ferroelectric layer and electrodes |
Mark Isenberger |
2007-01-16 |
$22,781,000 |
| 7125583 |
Chemical vapor deposition chamber pre-deposition treatment for improved carbon doped oxide thickness uniformity and throughput |
Kevin Peterson, Jeff Bielefeld |
2006-10-24 |
$13,658,000 |
| 7091615 |
Concentration graded carbon doped oxide |
Mark Bohr |
2006-08-15 |
$13,533,000 |
| 7078754 |
Methods and apparatuses for producing a polymer memory device |
Makarem A. Hussein, Peter K. Moon, Daniel Diana |
2006-07-18 |
$11,508,000 |
