Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of providing dielectric to conductor adhesion in package structures

Methods of providing dielectric to conductor adhesion in package structures

US Patent 9136221 · Granted Sep 15, 2015

Estimated economic value: $17,844,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wafer-level-packaged BAW devices with surface mount connection structures2019
Stealth-dicing compatible devices and methods to prevent acoustic backside refle2018
Formation of dielectric with smooth surface2018
Embedded structures for package-on-package architecture2017
Methods of providing dielectric to conductor adhesion in package structures2017
Methods of providing dielectric to conductor adhesion in package structures2017
Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric 2016
Embedded architecture using resin coated copper2016
Embedded structures for package-on-package architecture2016
Embedded structures for package-on-package architecture2014
Ferroelectric polymer memory module2012
Ferroelectric polymer memory module2010