Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9748177 | Embedded structures for package-on-package architecture | Weng Hong Teh | 2017-08-29 | $8,286,000 |
| 9633837 | Methods of providing dielectric to conductor adhesion in package structures | Ebrahim Andideh | 2017-04-25 | $8,972,000 |
| 9451696 | Embedded architecture using resin coated copper | Dilan Seneviratne, Ching-Ping Janet Shen, Liwen Jin, Deepak Arora | 2016-09-20 | $10,814,000 |
| 9368401 | Embedded structures for package-on-package architecture | Weng Hong Teh | 2016-06-14 | $9,885,000 |
| 9136221 | Methods of providing dielectric to conductor adhesion in package structures | Ebrahim Andideh | 2015-09-15 | $17,844,000 |
| 8866287 | Embedded structures for package-on-package architecture | Weng Hong Teh | 2014-10-21 | $23,195,000 |