Issued Patents All Time
Showing 26–50 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7078754 | Methods and apparatuses for producing a polymer memory device | Makarem A. Hussein, Peter K. Moon, Daniel Diana | 2006-07-18 |
| 7034380 | Low-dielectric constant structure with a multilayer stack of thin films with pores | — | 2006-04-25 |
| 7026670 | Ferroelectric memory device with a conductive polymer layer and a method of formation | — | 2006-04-11 |
| 7009272 | PECVD air gap integration | Wilmer F. Borger, Jeffrey West | 2006-03-07 |
| 7001782 | Method and apparatus for filling interlayer vias on ferroelectric polymer substrates | Daniel Diana, Richard M. Steger, Valery M. Dubin, Ming Fang | 2006-02-21 |
| 6974984 | Method to sputter deposit metal on a ferroelectric polymer | Hitesh Windlass, Daniel Diana, Mark Richards, William Hicks | 2005-12-13 |
| 6951764 | Ferroelectric memory device with a conductive polymer layer and a method of formation | — | 2005-10-04 |
| 6951506 | Polish pad with non-uniform groove depth to improve wafer polish rate uniformity | Matthew J. Prince | 2005-10-04 |
| 6914335 | Semiconductor device having a low-K dielectric layer | Qing Ma, Quan Tran, Steve Towle | 2005-07-05 |
| 6900063 | Methods and apparatuses for producing a polymer memory device | Makarem A. Hussein, Peter K. Moon, Daniel Diana | 2005-05-31 |
| 6890813 | Polymer film metalization | Daniel Diana | 2005-05-10 |
| 6887780 | Concentration graded carbon doped oxide | Mark Bohr | 2005-05-03 |
| 6846737 | Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials | Steven Towle, Lawrence Wong | 2005-01-25 |
| 6800548 | Method to avoid via poisoning in dual damascene process | — | 2004-10-05 |
| 6777759 | Device structure and method for reducing silicide encroachment | Robert S. Chau, Mitch Taylor, Chia-Hong Jan, Julie Tsai | 2004-08-17 |
| 6765273 | Device structure and method for reducing silicide encroachment | Robert S. Chau, Mitch Taylor, Chia-Hong Jan, Julie Tsai | 2004-07-20 |
| 6740579 | Method of making a semiconductor device that includes a dual damascene interconnect | — | 2004-05-25 |
| 6680262 | Method of making a semiconductor device by converting a hydrophobic surface of a dielectric layer to a hydrophilic surface | Kevin Peterson | 2004-01-20 |
| 6677253 | Carbon doped oxide deposition | Kevin Peterson, Jeffery D. Bielefeld | 2004-01-13 |
| 6664168 | Method of making an on-die decoupling capacitor for a semiconductor device | R. Scott List | 2003-12-16 |
| 6630390 | Method of forming a semiconductor device using a carbon doped oxide layer to control the chemical mechanical polishing of a dielectric layer | Clark H. Cummins | 2003-10-07 |
| 6624032 | Structure and process flow for fabrication of dual gate floating body integrated MOS transistors | Mohsen Alavi, Scott Thompson, Mark Bohr | 2003-09-23 |
| 6596646 | Method for making a sub 100 nanometer semiconductor device using conventional lithography steps | Alan M. Myers | 2003-07-22 |
| 6593650 | Plasma induced depletion of fluorine from surfaces of fluorinated low-k dielectric materials | Steven Towle, Lawrence Wong | 2003-07-15 |
| 6548399 | Method of forming a semiconductor device using a carbon doped oxide layer to control the chemical mechanical polishing of a dielectric layer | Clark H. Cummins | 2003-04-15 |