Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10663856 | Optical mask for use in a photolithography process, a method for fabricating the optical mask and a method for fabricating an array of patterns on a substrate using the optical mask | Johnny Chung Yin HO, Lei Shu | 2020-05-26 |
| 9741330 | Dual-diaphragm microphone module to reduce vibration noise | Po-Jen Tu, Jia-Ren Chang, Ming-Chun Yu | 2017-08-22 |
| 7567379 | Technique to prevent tin contamination of mirrors and electrodes in an EUV lithography system | Robert L. Bristol, Bryan Rice, John Barnak, Melissa Shell | 2009-07-28 |
| 7442634 | Method for constructing contact formations | Valery M. Dubin, Tzuen-Luh Huang, Kevin J. Lee, Yuehai Liang, Margherita Chang | 2008-10-28 |
| 7416980 | Forming a barrier layer in interconnect joints and structures formed thereby | Ting Zhong, Valery M. Dubin | 2008-08-26 |
| 7391112 | Capping copper bumps | Jianxing Li, Ting Zhong, Fay Hua, Kevin J. Lee | 2008-06-24 |
| 7314543 | Tin deposition | Valery M. Dubin, Scott Haight | 2008-01-01 |
| 7279720 | Large bumps for optical flip chips | Valery M. Dubin, Daoqiang Lu | 2007-10-09 |
| 7064446 | Under bump metallization layer to enable use of high tin content solder bumps | John Barnak, Gerald Feldewerth, Kevin J. Lee, Tzuen-Luh Huang, Harry Liang +3 more | 2006-06-20 |
| 7001782 | Method and apparatus for filling interlayer vias on ferroelectric polymer substrates | Daniel Diana, Ebrahim Andideh, Richard M. Steger, Valery M. Dubin | 2006-02-21 |
| 6933171 | Large bumps for optical flip chips | Valery M. Dubin, Daoqiang Lu | 2005-08-23 |