Ming Fang has been granted 11 US patents while listed as an inventor at Intel . The first was granted in 2005 and the most recent in May 2020. Ming Fang ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Ming Fang in Portland, OR, US.
Patents per Year Patents granted per year, 2005 to 2020 Bar chart with a peak of 4 patents in 2008. peak 4 2005: 1 patents 2005 2006: 2 patents 2006 2007: 1 patents 2007 2008: 4 patents 2008 2009: 1 patents 2009 2017: 1 patents 2017 2020: 1 patents 2020
Issued Patents All Time
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Showing 1–11 of 11 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
10663856 Optical mask for use in a photolithography process, a method for fabricating the optical mask and a method for fabricating an array of patterns on a substrate using the optical mask Johnny Chung Yin HO , Lei Shu 2020-05-26
9741330 Dual-diaphragm microphone module to reduce vibration noise Po-Jen Tu , Jia-Ren Chang , Ming-Chun Yu 2017-08-22
7567379 Technique to prevent tin contamination of mirrors and electrodes in an EUV lithography system Robert L. Bristol , Bryan Rice , John Barnak , Melissa Shell 2009-07-28
$29,156,000
7442634 Method for constructing contact formations Valery M. Dubin , Tzuen-Luh Huang , Kevin J. Lee , Yuehai Liang , Margherita Chang 2008-10-28
$18,166,000
7416980 Forming a barrier layer in interconnect joints and structures formed thereby Ting Zhong , Valery M. Dubin 2008-08-26
$24,347,000
7391112 Capping copper bumps Jianxing Li , Ting Zhong , Fay Hua , Kevin J. Lee 2008-06-24
$20,489,000
7314543 Tin deposition Valery M. Dubin , Scott Haight 2008-01-01
7279720 Large bumps for optical flip chips Valery M. Dubin , Daoqiang Lu 2007-10-09
$11,205,000
7064446 Under bump metallization layer to enable use of high tin content solder bumps John Barnak , Gerald Feldewerth , Kevin J. Lee , Tzuen-Luh Huang , Harry Liang +3 more 2006-06-20
$13,743,000
7001782 Method and apparatus for filling interlayer vias on ferroelectric polymer substrates Daniel Diana , Ebrahim Andideh , Richard M. Steger , Valery M. Dubin 2006-02-21
$16,743,000
6933171 Large bumps for optical flip chips Valery M. Dubin , Daoqiang Lu 2005-08-23
$20,377,000
