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Optical mask for use in a photolithography process, a method for fabricating the optical mask and a method for fabricating an array of patterns on a substrate using the optical mask |
Johnny Chung Yin HO, Lei Shu |
2020-05-26 |
| 9741330 |
Dual-diaphragm microphone module to reduce vibration noise |
Po-Jen Tu, Jia-Ren Chang, Ming-Chun Yu |
2017-08-22 |
| 7567379 |
Technique to prevent tin contamination of mirrors and electrodes in an EUV lithography system |
Robert L. Bristol, Bryan Rice, John Barnak, Melissa Shell |
2009-07-28 |
| 7442634 |
Method for constructing contact formations |
Valery M. Dubin, Tzuen-Luh Huang, Kevin J. Lee, Yuehai Liang, Margherita Chang |
2008-10-28 |
| 7416980 |
Forming a barrier layer in interconnect joints and structures formed thereby |
Ting Zhong, Valery M. Dubin |
2008-08-26 |
| 7391112 |
Capping copper bumps |
Jianxing Li, Ting Zhong, Fay Hua, Kevin J. Lee |
2008-06-24 |
| 7314543 |
Tin deposition |
Valery M. Dubin, Scott Haight |
2008-01-01 |
| 7279720 |
Large bumps for optical flip chips |
Valery M. Dubin, Daoqiang Lu |
2007-10-09 |
| 7064446 |
Under bump metallization layer to enable use of high tin content solder bumps |
John Barnak, Gerald Feldewerth, Kevin J. Lee, Tzuen-Luh Huang, Harry Liang +3 more |
2006-06-20 |
| 7001782 |
Method and apparatus for filling interlayer vias on ferroelectric polymer substrates |
Daniel Diana, Ebrahim Andideh, Richard M. Steger, Valery M. Dubin |
2006-02-21 |
| 6933171 |
Large bumps for optical flip chips |
Valery M. Dubin, Daoqiang Lu |
2005-08-23 |