JL

Jianxing Li

HO Honeywell: 19 patents #386 of 14,447Top 3%
IN Intel: 2 patents #13,213 of 30,777Top 45%
Nichia: 1 patents #1,005 of 1,531Top 70%
XU Xi'An Jiaotong University: 1 patents #201 of 791Top 30%
📍 Spokane Valley, WA: #4 of 201 inventorsTop 2%
🗺 Washington: #2,836 of 76,902 inventorsTop 4%
Overall (All Time): #136,298 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 1–25 of 28 patents

Patent #TitleCo-InventorsDate
11980351 Device for visible puncture Jinping LI, Chengpeng LIU, Gang Long, Yeyun Mao, Xuecheng Hu 2024-05-14
11682817 W-band E-plane waveguide bandpass filter Kaida Xu, Yiqun Liu, Xiaoming Chen, Anxue Zhang 2023-06-20
11357393 Endoscope Gang Long, Xuecheng Hu, Jinping LI, Shaogang Wang, Junhui Zhang +2 more 2022-06-14
10661393 Lead-free solder compositions Michael R. Pinter, Vikki L. Johnson 2020-05-26
10617283 Self-locking angle adjustment mechanism for endoscope Shaogang Wang, Xiaolin Guo, Jian Huang, Xu Zhang, Jihong Liu +15 more 2020-04-14
10542876 Multidirectional turning endoscope Shaogang Wang, Xiao Feng Yu, Yeyun Mao, Zhangqun Ye, Jian Huang +15 more 2020-01-28
10046417 Lead-free solder compositions Michael R. Pinter, Vikki L. Johnson 2018-08-14
9520347 Lead frame construct for lead-free solder connections Kevin B. Albaugh 2016-12-13
7391112 Capping copper bumps Ming Fang, Ting Zhong, Fay Hua, Kevin J. Lee 2008-06-24
7325716 Dense intermetallic compound layer Christopher August Debelius 2008-02-05
7153468 Physical vapor deposition targets and methods of formation Vasanth Mohan, Timothy A. Scott 2006-12-26
7017382 Methods of forming aluminum-comprising physical vapor deposition targets; sputtered films; and target constructions Vladimir Segal, Frank Alford, Stephane Ferrasse 2006-03-28
6815084 Discontinuous high-modulus fiber metal matrix composite for thermal management applications Tim Scott, Tamara White 2004-11-09
6797079 Physical vapor deposition target Shozo Nagano, Hinrich Hargarter, Jane Buehler 2004-09-28
6758920 Conductive integrated circuit metal alloy interconnections, electroplating anodes; metal alloys for use as a conductive interconnection in an integrated circuit; and physical vapor deposition targets Shozo Nagano, Hinrich Hargarter, Jane Buehler 2004-07-06
6746619 Ferroelectric vapor deposition targets Tim Scott, Tamara White 2004-06-08
6730198 Container-shaped physical vapor deposition targets Michael R. Pinter, Steven Wu 2004-05-04
6682636 Physical vapor deposition targets and methods of formation Vasanth Mohan, Timothy A. Scott 2004-01-27
6596131 Carbon fiber and copper support for physical vapor deposition target assembly and method of forming Tim Scott 2003-07-22
6596139 Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications Tim Scott, Tamara White 2003-07-22
6579467 Ferroelectric composition, ferroelectric vapor deposition target and method of making a ferroelectric vapor deposition target Tim Scott, Tamara White 2003-06-17
6482302 Container-shaped physical vapor deposition targets Michael R. Pinter, Steven Wu 2002-11-19
6451222 Ferroelectric composition, ferroelectric vapor deposition target and method of making a ferroelectric vapor deposition target Tim Scott, Tamara White 2002-09-17
6440243 Methods of forming ceramic compositions Qi Tan 2002-08-27
6358433 Ceramic compositions Qi Tan 2002-03-19