Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10321573 | Solder contacts for socket assemblies | Fay Hua, Hong Xie, Gregorio R. Murtagian, Amit Abraham, Alan McAllister | 2019-06-11 |
| 10099307 | Interconnect alloy material and methods | Rajashree Baskaran, Aleksandar Aleksov | 2018-10-16 |
| 9860988 | Solder contacts for socket assemblies | Fay Hua, Hong Xie, Gregorio R. Murtagian, Amit Abraham, Alan McAllister | 2018-01-02 |
| 9835648 | Liquid metal interconnects | Rajashree Baskaran, Kimin Jun, Roy E. Swart, Paul B. Fischer | 2017-12-05 |
| 9731369 | Interconnect alloy material and methods | Rajashree Baskaran, Aleksandar Aleksov | 2017-08-15 |
| 9523713 | Interconnects including liquid metal | Youngseok Oh, Joe Walczyk, Jin-Bin Yang, Pooya Tadayon | 2016-12-20 |
| 9010618 | Magnetic attachment structure | Aleksandar Aleksov, Rajasekaran Swaminathan | 2015-04-21 |
| 8434668 | Magnetic attachment structure | Aleksandar Aleksov, Rajasekaran Swaminathan | 2013-05-07 |
| 7919859 | Copper die bumps with electromigration cap and plated solder | Val Dubin, Mark Bohr | 2011-04-05 |
| 7416980 | Forming a barrier layer in interconnect joints and structures formed thereby | Valery M. Dubin, Ming Fang | 2008-08-26 |
| 7391112 | Capping copper bumps | Jianxing Li, Ming Fang, Fay Hua, Kevin J. Lee | 2008-06-24 |
| 7223695 | Methods to deposit metal alloy barrier layers | Fay Hua, Valery M. Dubin | 2007-05-29 |
| 7087104 | Preparation of electroless deposition solutions | Hok-Kin Choi, Vani Thirumala, Valery M. Dubin, Chin-Chang Cheng | 2006-08-08 |