Ting Zhong has been granted 13 US patents while listed as an inventor at Intel . The first was granted in 2006 and the most recent in June 2019. Ting Zhong ranks #362,438 of 4,157,543 US inventors in our database (top 8.7%). Patent records list Ting Zhong in Tigard, OR, US.
Patents per Year Patents granted per year, 2006 to 2019 Bar chart with a peak of 2 patents in 2008. peak 2 2006: 1 patents 2006 2007: 1 patents 2007 2008: 2 patents 2008 2011: 1 patents 2011 2013: 1 patents 2013 2015: 1 patents 2015 2016: 1 patents 2016 2017: 2 patents 2017 2018: 2 patents 2018 2019: 1 patents 2019
Issued Patents All Time
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Showing 1–13 of 13 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
10321573 Solder contacts for socket assemblies Fay Hua , Hong Xie , Gregorio R. Murtagian , Amit Abraham , Alan McAllister 2019-06-11
$16,707,000
10099307 Interconnect alloy material and methods Rajashree Baskaran , Aleksandar Aleksov 2018-10-16
$21,459,000
9860988 Solder contacts for socket assemblies Fay Hua , Hong Xie , Gregorio R. Murtagian , Amit Abraham , Alan McAllister 2018-01-02
$11,729,000
9835648 Liquid metal interconnects Rajashree Baskaran , Kimin Jun , Roy E. Swart , Paul B. Fischer 2017-12-05
$17,379,000
9731369 Interconnect alloy material and methods Rajashree Baskaran , Aleksandar Aleksov 2017-08-15
$8,272,000
9523713 Interconnects including liquid metal Youngseok Oh , Joe Walczyk , Jin-Bin Yang , Pooya Tadayon 2016-12-20
$13,656,000
9010618 Magnetic attachment structure Aleksandar Aleksov , Rajasekaran Swaminathan 2015-04-21
$17,773,000
8434668 Magnetic attachment structure Aleksandar Aleksov , Rajasekaran Swaminathan 2013-05-07
$21,295,000
7919859 Copper die bumps with electromigration cap and plated solder Val Dubin , Mark Bohr 2011-04-05
$23,551,000
7416980 Forming a barrier layer in interconnect joints and structures formed thereby Valery M. Dubin , Ming Fang 2008-08-26
$24,347,000
7391112 Capping copper bumps Jianxing Li , Ming Fang , Fay Hua , Kevin J. Lee 2008-06-24
$20,489,000
7223695 Methods to deposit metal alloy barrier layers Fay Hua , Valery M. Dubin 2007-05-29
$13,871,000
7087104 Preparation of electroless deposition solutions Hok-Kin Choi , Vani Thirumala , Valery M. Dubin , Chin-Chang Cheng 2006-08-08
$12,359,000
